Kiyofumi Yamamoto

Title: Kiyofumi Yamamoto: Imaging and Substrate-Joining Innovations.

Introduction

Kiyofumi Yamamoto is an inventor associated with Kanagawa, Japan, and Fujifilm Corporation. His patent work includes technologies for manufacturing imaging modules and joining substrates. His portfolio includes 10 patents.

Latest Patents

“Image Pickup Module Manufacturing Method and Image Pickup Module Manufacturing Device” describes a process for accurately positioning an imaging element unit relative to a lens unit. The device holds the lens unit and imaging element unit, captures an image of a measurement chart, and uses the resulting signals to adjust the imaging element unit’s position and inclination.

“Device and Method for Joining Substrates” describes equipment for joining a wafer and a glass substrate in a clean booth. The process applies adhesive to the glass substrate using a transcribing film, removes the film, aligns the substrates, adjusts the parallelism of their joining surfaces, and joins them. Performing these steps in a clean environment helps prevent contamination that could reduce product yield.

Career Highlights

Yamamoto’s listed inventions address precision manufacturing challenges in imaging and substrate assembly. His work includes methods and equipment designed to improve alignment accuracy and reduce the risk of defects during production.

Collaborations

His listed coworkers include Kazuhiro Nishida and Kosuke Takasaki. These collaborations are associated with patent work in imaging-module manufacturing and substrate joining.

Conclusion

Kiyofumi Yamamoto’s patents reflect a focus on precise positioning, clean manufacturing, and reliable assembly processes at Fujifilm Corporation.