The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Jan. 08, 2010
Kosuke Takasaki, Kanagawa, JP;
Kiyofumi Yamamoto, Kanagawa, JP;
Kazuo Okutsu, Kanagawa, JP;
Koji Tsujimura, Kanagawa, JP;
Kosuke Takasaki, Kanagawa, JP;
Kiyofumi Yamamoto, Kanagawa, JP;
Kazuo Okutsu, Kanagawa, JP;
Koji Tsujimura, Kanagawa, JP;
Fujifilm Corporation, Tokyo, JP;
Abstract
A device for joining substrates () is provided inside a clean booth (). a single axis robot () and a five axis robot () convey a wafer () and a glass substrate (). A transcribing station () obtains a transcribing film () on which adhesive is applied from a film supplying section (), and presses the transcribing film () to the glass substrate () so as to transcribe the adhesive to the glass substrate (). A peeling station () peels the transcribing film () from the glass substrate (). A joining station () positions the wafer () and the glass substrate (), adjusts parallelism of joining surfaces of the wafer () and the glass substrate (), and joins these substrates together. Since the handling and the joining of the wafer (), the glass substrate () and the transcribing film () are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.