IDiyas

For the Inventor, By the Inventor

Milpitas, CA, United States of America

Khanh Tran

USPTO Granted Patents = 12

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 61(Granted Patents)


Company Filing History:

goldMedal11 out of 1,284 
 
Maxim Integrated Products, Inc.
 patents
silverMedal1 out of 203 
 
Psiquantum Corp.
 patents

Years Active: 2003-2025

where 'Filed Patents' based on already Granted Patents

12 patents (USPTO):
1. 12436337 - Low loss optical interposer (2025-10-07),
2. 10211172 - Wafer-based electronic component packaging (2019-02-19),
3. 10056294 - Techniques for adhesive control between a substrate and a die (2018-08-21),
4. 9882075 - Light sensor with vertical diode junctions (2018-01-30),
5. 9704809 - Fan-out and heterogeneous packaging of electronic components (2017-07-11),
6. 9608130 - Semiconductor device having trench capacitor structure integrated therein (2017-03-28),
7. 9520462 - Semiconductor device having capacitor integrated therein (2016-12-13),
8. 9196672 - Semiconductor device having capacitor integrated therein (2015-11-24),
9. 8847365 - Inductors and methods for integrated circuits (2014-09-30),
10. 8344478 - Inductors having inductor axis parallel to substrate surface (2013-01-01),
11. 7943473 - Minimum cost method for forming high density passive capacitors for replacement of discrete board capacitors using a minimum cost 3D wafer-to-wafer modular integration scheme (2011-05-17),
12. 6607962 - Globally planarized backend compatible thin film resistor contact/interconnect process (2003-08-19),

Title: The Innovative Contributions of Khanh Tran

Introduction

Khanh Tran is a notable inventor based in Milpitas, California, with a remarkable portfolio of 12 patents. His work primarily focuses on advancements in optical interposers and electronic component packaging, showcasing his expertise in the field of photonics and semiconductor technology.

Latest Patents

One of Khanh Tran's latest patents is the "Low Loss Optical Interposer." This invention involves creating an optical interposer from multiple wafers, including a photonic integrated circuit wafer and an interposer wafer. The design allows for the bonding of the photonic integrated circuit wafer to a rigid carrier structure, with the ability to remove material near waveguides for optimal coupling. Additionally, the photonic integrated circuit can be divided into multiple rigid dies, which can be bonded to the interposer separately, facilitating the formation of electrical connections to create an ultra-low optical interposer.

Another significant patent is the "Wafer-Based Electronic Component Packaging." This invention describes a surface mount device that includes at least one semiconductor device with an exposed top metal and an encapsulation layer. The device is designed to ensure electrical connections from one side to the other, utilizing a detailed fabrication process that includes dicing, backgrinding, and encapsulating the finished device wafer.

Career Highlights

Khanh Tran has made significant contributions while working at prominent companies such as Maxim Integrated Products, Inc. and PsiQuantum Corporation. His experience in these organizations has allowed him to develop innovative solutions that push the boundaries of technology.

Collaborations

Throughout his career, Khanh has collaborated with talented individuals, including Joseph P. Ellul and Anuranjan Srivastava. These partnerships have fostered an environment of creativity and innovation, leading to the development of groundbreaking technologies.

Conclusion

Khanh Tran's contributions to the fields of photonics and semiconductor technology are noteworthy. His innovative patents and collaborations reflect his commitment to advancing technology and improving electronic components. His work continues to inspire future innovations in the industry.

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