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For the Inventor, By the Inventor

Hsin-Chu, Taiwan

Keung Hui

USPTO Granted Patents = 11

Average Co-Inventor Count = 3.9

ph-index = 3

Forward Citations = 26(Granted Patents)


Company Filing History:

goldMedal11 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2012-2018

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11 patents (USPTO):Explore Patents
1. 10096482 - Apparatus and method for chemical mechanical polishing process control (2018-10-09),
2. 9323244 - Semiconductor fabrication component retuning (2016-04-26),
3. 9158301 - Semiconductor processing dispatch control (2015-10-13),
4. 9132523 - Chemical mechanical polish process control for improvement in within-wafer thickness uniformity (2015-09-15),
5. 9102033 - Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing process (2015-08-11),
6. 8925479 - System and method of dosage profile control (2015-01-06),
7. 8781614 - Semiconductor processing dispatch control (2014-07-15),
8. 8309444 - System and method of dosage profile control (2012-11-13),
9. 8295965 - Semiconductor processing dispatch control (2012-10-23),
10. 8294124 - Scanning method and system using 2-D ion implanter (2012-10-23),
11. 8129279 - Chemical mechanical polish process control for improvement in within-wafer thickness uniformity (2012-03-06),

Title: **Innovative Contributions of Keung Hui in Semiconductor Technology**

Introduction

Keung Hui is a renowned inventor based in Hsin-Chu, Taiwan, recognized for his significant contributions to the field of semiconductor technology. With a remarkable portfolio of 11 patents, Hui's innovations have greatly advanced the methods and processes used in semiconductor fabrication.

Latest Patents

Among his latest patents, Hui has developed an "Apparatus and Method for Chemical Mechanical Polishing Process Control." This invention details a sophisticated apparatus designed to ensure uniformity in thickness and surface profile during the chemical mechanical polishing (CMP) process. This method involves the assessment of surface profiles of multiple wafers, followed by the determination of CMP polishing recipes tailored to each wafer's operational requirements.

In a separate groundbreaking invention, Hui has provided insights into "Semiconductor Fabrication Component Retuning." This patent outlines systems and techniques aimed at retuning semiconductor fabrication components. It discusses the evaluation and adjustment of key fabrication parameters, ultimately enhancing the overall performance of semiconductor processing through data analysis and simulation.

Career Highlights

Keung Hui has dedicated his career to advancing semiconductor technologies, showcasing his expertise through numerous patents. His role at Taiwan Semiconductor Manufacturing Company Ltd. places him at the forefront of innovation in the industry, where he continues to develop cutting-edge solutions that improve semiconductor manufacturing processes.

Collaborations

Hui's work has often been supported by collaborations with esteemed colleagues such as Jong-I Mou and Yen-Di Tsen. These professional relationships have fostered an environment of collective innovation, making significant strides in the field of semiconductor technology.

Conclusion

Keung Hui's contributions to semiconductor fabrication technologies underscore the importance of innovation in modern engineering. With his impressive array of patents and collaborative spirit, Hui continues to influence the future of the semiconductor industry, paving the way for advancements that enhance efficiency and performance in manufacturing processes.

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