The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Oct. 13, 2008
Shen-nan Lee, Jhudong, TW;
Ying-mei Lin, Keelung, TW;
Yu-jen Cheng, Hsin-Chu, TW;
Keung Hui, Hsin-Chu, TW;
Huan-just Lin, Hsin-Chu, TW;
Shen-Nan Lee, Jhudong, TW;
Ying-Mei Lin, Keelung, TW;
Yu-Jen Cheng, Hsin-Chu, TW;
Keung Hui, Hsin-Chu, TW;
Huan-Just Lin, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method of performing chemical mechanical polish (CMP) processes on a wafer includes providing the wafer; determining a thickness profile of a feature on a surface of the wafer; and, after the step of determining the thickness profile, performing a high-rate CMP process on the feature using a polish recipe to substantially achieve a within-wafer thickness uniformity of the feature. The polish recipe is determined based on the thickness profile.