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For the Inventor, By the Inventor

Taipei, Taiwan

Yu-Jen Cheng

This inventor holds 22 USPTO granted patents, primarily in Fingerprint Sensing Technology. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Lextar Electronics Corporation, Richtek Technology Corporation. Active years: 2012-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Jen Cheng. Retrieved from https://idiyas.com/inventor/yu-jen-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22

% Patents Active = 81.8

Average Co-Inventor Count = 6.5

ph-index = 3

Forward Citations = 36(Granted Patents)


Location History:

  • New Taipei, TW (2017 - 2023)
  • Hsinchu, TW (2012 - 2024)

Company Filing History:

goldMedal20 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 401 
 
Lextar Electronics Corporation
 patents
bronzeMedal1 out of 836 
 
Richtek Technology Corporation
 patents

Years Active: 2012-2025

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Areas of Expertise:
Fingerprint Sensor
Semiconductor Packaging
Integrated Circuit
Die Package
Pixel Array
Manufacturing Method
Chemical Mechanical Polish
Process Control
Interface Control Circuit
Reactive Ion Etching
Endpoint Determination
Wafer Thickness Uniformity
22 patents (USPTO):Explore Patents
1. 12394242 - Fingerprint sensor device and method (2025-08-19),
2. 12237288 - Semiconductor die package and method of manufacture (2025-02-25),
3. 11990443 - Semiconductor die package and method of manufacture (2024-05-21),
4. 11727714 - Fingerprint sensor device and method (2023-08-15),
5. 11194990 - Fingerprint sensor device and method (2021-12-07),
6. 11146056 - Interface control circuit and control method thereof (2021-10-12),
7. 11121288 - Package structure of light-emitting element (2021-09-14),
8. 10878073 - Fingerprint sensor pixel array and methods of forming same (2020-12-29),
9. 10698994 - Fingerprint sensor pixel array and methods of forming same (2020-06-30),
10. 10658334 - Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die (2020-05-19),
11. 10268872 - Fingerprint sensor device and method (2019-04-23),
12. 10157274 - Fingerprint sensor pixel array and methods of forming same (2018-12-18),
13. 10125014 - Integrated circuit package and method of forming same (2018-11-13),
14. 9904776 - Fingerprint sensor pixel array and methods of forming same (2018-02-27),
15. 9898645 - Fingerprint sensor device and method (2018-02-20),

Title: The Innovative Journey of Yu-Jen Cheng

Introduction: Yu-Jen Cheng is a pioneering inventor hailing from New Taipei, Taiwan. His relentless passion for innovation has led to groundbreaking contributions in the field of technology and beyond.

Latest Patents: Yu-Jen Cheng holds several patents in various technological domains, showcasing his versatility and ingenuity in creating novel solutions to complex problems.

Career Highlights: Throughout his illustrious career, Yu-Jen Cheng has consistently pushed the boundaries of what is possible. His innovative spirit has earned him recognition as a trailblazer in the world of inventions.

Collaborations: Yu-Jen Cheng has collaborated with leading experts and organizations in the industry, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have resulted in the development of cutting-edge technologies that have made a significant impact on society.

Conclusion: In conclusion, Yu-Jen Cheng stands as a beacon of inspiration for aspiring inventors worldwide. His dedication to innovation and his remarkable contributions to the field have solidified his legacy as a true visionary.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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