Taiwan Semiconductor Manufacturing Comp. Ltd.

Richtek Technology Corporation

Lextar Electronics Corporation

Yu-Jen Cheng

Yu-Feng Chen

Hao-Yi Tsai

Yu-Chih Huang

Chung-Shi Liu

Chih-Hua Chen

Chen-Hua Douglas Yu

Chih-Wei Lin

Chih-Hsuan Tai

Shang-Yun Hou

Huan-Just Lin

Sung-Hui Huang

Kuan-Yu Huang

Shen-Nan Lee

Kuo Lung Pan

Keung Hui

Wen-Yao Chang

Yu-Yun Huang

Ying-Mei Lin

Shu Chia Hsu

Chen-Shien Chen

Chih-Wei Hsu

Mirng-Ji Lii

Han-Ping Pu

Tsang-Jiuh Wu

Jong-I Mou

Hung-Pin Chang

Chun-Hsien Lin

Kuo-Lung Pan

Jo Fei Wang

Chien Rhone Wang

Chih-Wei Lai

Shin-Rung Lu

Che-Hung Lin

Andy Tsen

Wei-Sen Chang

Wei-Chung Chang

Wen-Pin Liu

Tzu-Cheng Lin

Chieh-Min Lo

Chih-Wei Mu

Shun-Ping Wang

Sheng-Tsung Chen

Jung-Tang Chu

Kun-Yang Hsieh

A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

Fingerprint sensor device and method

In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.

Semiconductor die package and method of manufacture

An interface control circuit complying with an interface specification includes: an interface signal transceiver circuit and a protection circuit. The interface signal transceiver circuit is coupled to a first interface connection pin and a second interface connection pin of a first interface connector circuit. The interface signal transceiver circuit is for transmitting and/or receiving an interface signal according to the interface specification. When the interface signal transceiver circuit operates under a first state, the protection circuit determines whether a foreign object exists between the first interface connection pin and the second interface connection pin according to a voltage change or a current change at the second interface connection pin. Under the first state, the interface signal transceiver circuit generates a pull-up signal and a pull-down signal which are toggled with each other at the first interface connection pin.

Interface control circuit and control method thereof

A package structure of a light-emitting element includes a shell, a first conductive path, a second conductive path, a light-emitting device, a cover, a first light-transmitting sensing electrode, and a second light-transmitting sensing electrode. The shell has a top surface and a bottom surface, and the top surface is recessed toward the bottom surface to form an accommodating space. Each of the first and second conductive paths extends from the top surface to the bottom surface. The light-emitting device is disposed in the accommodating space. The cover is disposed over the shell. The first and second light-transmitting sensing electrodes are disposed on the same surface of the cover, and a capacitance is formed between the first and second light-transmitting sensing electrodes. The first and second light-transmitting sensing electrodes are electrically connected to the first and second conductive paths, respectively.

Package structure of light-emitting element

A device package includes a sensor die, one or more additional dies adjacent the sensor die, and a molding compound encircling the sensor die and the one or more additional dies. The device package further includes redistribution layers over the sensor die, the one or more additional dies, and the molding compound. The redistribution layers include first conductive features in a first dielectric layer. The first conductive features electrically connect the sensor die to the one or more additional dies. The redistribution layers further include an array of electrodes in a second dielectric layer over the first dielectric layer and electrically connected to the sensor die.

Fingerprint sensor pixel array and methods of forming same

Package structures and methods for forming the same are provided. The method includes providing a first integrated circuit die and forming a redistribution structure over the first integrated circuit die. The method also includes forming a base layer over the redistribution structure. The base layer has first and second openings. The first openings are wider than the second openings. The method further includes forming first bumps over the redistribution structure. The first bumps have a lower portion filling the first openings. In addition, the method includes bonding a second integrated circuit die to the redistribution structure through second bumps having a lower portion filling the second openings. There is a space between the second integrated circuit die and the base layer. The method also includes forming a molding compound layer over the base layer. The molding compound layer fills the space and surrounds the first and second bumps.

Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die

Integrated circuit packages and methods of forming same are provided. A method includes attaching a first die and a second die to a carrier, the first die having a first contact pad, the second die having a second contact pad, the first contact pad and the second contact pad having different structures. A release layer is formed over the first die and the second die. An encapsulant is injected between the carrier and the release layer. One or more redistribution layers (RDLs) are formed over the first die, the second die and the encapsulant, the first contact pad and the second contact pad being in electrical contact with the one or more RDLs.

Integrated circuit package and method of forming same

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Taipei, Taiwan

Yu-Jen Cheng