Company Filing History:
Years Active: 2012-2015
Title: Ying-Mei Lin: Innovator in Chemical Mechanical Polishing
Introduction
Ying-Mei Lin is a notable inventor based in Keelung, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of chemical mechanical polishing (CMP). With a total of 2 patents, his work focuses on improving the uniformity of wafer thickness during the CMP process.
Latest Patents
Ying-Mei Lin's latest patents include a method for performing chemical mechanical polish processes on a wafer. This method involves providing the wafer, determining a thickness profile of a feature on the surface, and then performing a high-rate CMP process using a polish recipe tailored to achieve within-wafer thickness uniformity. The polish recipe is determined based on the thickness profile, ensuring optimal results in the CMP process.
Career Highlights
Ying-Mei Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in CMP processes has positioned him as a valuable asset to the company, contributing to advancements in semiconductor manufacturing technology.
Collaborations
Ying-Mei Lin has collaborated with notable colleagues such as Shen-Nan Lee and Yu-Jen Cheng. Their combined efforts in research and development have furthered innovations in the semiconductor field.
Conclusion
Ying-Mei Lin's contributions to chemical mechanical polishing have made a significant impact on the semiconductor industry. His innovative methods and collaborative spirit continue to drive advancements in technology.