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For the Inventor, By the Inventor

Kawasaki, Japan

Kenichi Watanabe

This inventor holds 89 USPTO granted patents and 5 EPO patents, primarily in Semiconductor Devices (CPC class H01L23-528). Top assignees: Fujitsu Semiconductor Limited, Fujitsu Corporation, Socionext Inc.. Active years: 1996-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenichi Watanabe. Retrieved from https://idiyas.com/inventor/kenichi-watanabe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 89

% Patents Active = 62.9


Average Co-Inventor Count = 1.4

ph-index = 14

Forward Citations = 486(Granted Patents)

Forward Citations (Not Self Cited) = 301(Dec 10, 2025)


Inventors with similar research interests:

🔬 See more inventors

Location History:

  • Kawasaki, JP (2002 - 2015)
  • Kuwana, JP (2016 - 2020)
  • Yokohama, JP (1996 - 2022)

Company Filing History:

goldMedal43 out of 1,674 
 
Fujitsu Semiconductor Limited
 patents
silverMedal19 out of 39,378 
 
Fujitsu Corporation
 patents
bronzeMedal13 out of 711 
 
Socionext Inc.
 patents
4. 5 out of 467 
 
Fujitsu Microelectronics Limited
 patents
5. 4 out of 1,109 
 
Chisso Corporation
 patents
6. 2 out of 352 
 
Sumitomo Electric Device Innovations, Inc.
 patents
7. 2 out of 3 
 
Tokyo Pet Kabushiki Kaisha
 patents
8. 1 out of 28,957 
 
Ricoh Company, Ltd.
 patents

Years Active: 1996-2022

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Areas of Expertise:
Semiconductor Device
Groove-Shaped Via-Hole
Multilayer Interconnection
Capacitor
Damascene Method
Manufacturing Method
Interconnection Structure
Fabrication Method
Capacitor Element
Wiring
Two Groove-Shaped Patterns
89 patents (USPTO):Explore Patents
1. 11476110 - Semiconductor device (2022-10-18),
2. 11011370 - Method for manufacturing semiconductor device (2021-05-18),
3. 10840130 - Semiconductor device and semiconductor device fabrication method (2020-11-17),
4. 10546773 - Semiconductor device and semiconductor device fabrication method (2020-01-28),
5. 10403543 - Semiconductor device having groove-shaped via-hole (2019-09-03),
6. 9972531 - Method of manufacturing a semiconductor device having groove-shaped via-hole (2018-05-15),
7. 9947575 - Semiconductor device and semiconductor device fabrication method (2018-04-17),
8. 9502353 - Semiconductor device having groove-shaped via-hole (2016-11-22),
9. 9412699 - Semiconductor device having groove-shaped via-hole (2016-08-09),
10. 9412698 - Semiconductor device having groove-shaped via-hole (2016-08-09),
11. 9412697 - Semiconductor device having groove-shaped via-hole (2016-08-09),
12. 9412696 - Semiconductor device having groove-shaped via-hole (2016-08-09),
13. 9406613 - Semiconductor device having groove-shaped via-hole (2016-08-02),
14. 9406612 - Semiconductor device having groove-shaped via-hole (2016-08-02),
15. 9406611 - Semiconductor device having groove-shaped via-hole (2016-08-02),

Title: Kenichi Watanabe: Pioneering Inventor from Kawasaki

Introduction: Kenichi Watanabe is a distinguished inventor hailing from Kawasaki, Japan, known for his groundbreaking contributions to the field of innovation and technology.

Latest Patents: Kenichi Watanabe holds several patents in various technological domains, showcasing his continuous commitment to pushing the boundaries of invention and creativity.

Career Highlights: Throughout his illustrious career, Kenichi Watanabe has been at the forefront of numerous technological advancements, revolutionizing industries with his inventive solutions and forward-thinking approach.

Collaborations: Kenichi Watanabe has collaborated with leading research institutions, universities, and innovative companies, fostering a culture of innovation and knowledge-sharing to drive progress in the technological landscape.

Conclusion: Kenichi Watanabe stands as a visionary inventor whose relentless pursuit of innovation has left an indelible mark on the world of technology, inspiring future generations to continue pushing the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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