logo

For the Inventor, By the Inventor

Oita, Japan

Kengo Aoya

This inventor holds 22 USPTO granted patents and 18 published patent applications, primarily in Semiconductor Packaging. Top assignee: Texas Instruments Corporation. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kengo Aoya. Retrieved from https://idiyas.com/inventor/kengo-aoya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 52(Granted Patents)


Location History:

  • Hayami-Gun, JP (2014)
  • Beppu, JP (2011 - 2024)
  • Oita, JP (2020 - 2024)

Company Filing History:

goldMedal22 out of 29,888 
 
Texas Instruments Corporation
 patents

Years Active: 2011-2026

Loading Chart...
Areas of Expertise:
Power Converter Module
Embedded Die Packaging
Heat Dissipation
Semiconductor Device
IC Package
Multichip Module
Stress Buffer Layer
Micro-Ball Loading
Transformers
Wafer Chip Scale
22 patents (USPTO):Explore Patents
1. 12712469 - POWER CONVERTER MODULE (2026-08-18),
2. 12712122 - TRANSFORMERS WITH SEPARATED MAGNETIC MEMBERS (2026-08-18),
3. 12272626 - Conductive members atop semiconductor packages (2025-04-08),
4. 12154861 - Frame design in embedded die package (2024-11-26),
5. 12125799 - Embedded die packaging with integrated ceramic substrate (2024-10-22),
6. 12046542 - Heat-dissipating wirebonded members on package surfaces (2024-07-23),
7. 12040260 - Electronic package with surface contact wire extensions (2024-07-16),
8. 11942384 - Semiconductor package having an interdigitated mold arrangement (2024-03-26),
9. 11923320 - Semiconductor device having tapered metal coated sidewalls (2024-03-05),
10. 11848244 - Leaded wafer chip scale packages (2023-12-19),
11. 11601065 - Power converter module (2023-03-07),
12. 11410875 - Fan-out electronic device (2022-08-09),
13. 11387179 - IC package with half-bridge power module (2022-07-12),
14. 11183460 - Embedded die packaging with integrated ceramic substrate (2021-11-23),
15. 11183441 - Stress buffer layer in embedded package (2021-11-23),

Title: Innovations and Contributions of Kengo Aoya in Semiconductor Technology

Introduction: Kengo Aoya is a prominent inventor based in Oita, Japan, recognized for his significant contributions to semiconductor technology. With a remarkable portfolio of 20 patents, Aoya has played a vital role in advancing the field.

Latest Patents: Among his latest innovations, Aoya has developed a patent for "Conductive members atop semiconductor packages." This innovation entails a semiconductor package that includes a semiconductor die, a mold compound, and leads with specific geometric configurations enhancing electrical connectivity. Another noteworthy patent is for the "Frame design in embedded die package," which features an embedded die package with an exposed boundary made of organic material. This design improves the arrangement and integration of integrated circuit dies.

Career Highlights: Kengo Aoya is currently affiliated with Texas Instruments Corporation, a global leader in semiconductor design and manufacturing. His role at the company allows him to apply his inventive expertise and contribute to cutting-edge technology development.

Collaborations: Throughout his career, Aoya has collaborated with notable colleagues, including Woochan Kim and Anindya Poddar. Their combined efforts in research and development have led to innovative solutions in the semiconductor industry.

Conclusion: Kengo Aoya's work exemplifies the spirit of innovation in semiconductor technology. As he continues to develop groundbreaking patents and collaborate with esteemed colleagues, his contributions will likely shape the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…