IDiyas

For the Inventor, By the Inventor

Oita, Japan

Kengo Aoya

USPTO Granted Patents = 20 

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 52(Granted Patents)


Location History:

  • Hayami-Gun, JP (2014)
  • Beppu, JP (2011 - 2024)
  • Oita, JP (2020 - 2024)

Company Filing History:

goldMedal20 out of 29,232 
 
Texas Instruments Corporation
 patents

Years Active: 2011-2025

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20 patents (USPTO):Explore Patents
1. 12272626 - Conductive members atop semiconductor packages (2025-04-08),
2. 12154861 - Frame design in embedded die package (2024-11-26),
3. 12125799 - Embedded die packaging with integrated ceramic substrate (2024-10-22),
4. 12046542 - Heat-dissipating wirebonded members on package surfaces (2024-07-23),
5. 12040260 - Electronic package with surface contact wire extensions (2024-07-16),
6. 11942384 - Semiconductor package having an interdigitated mold arrangement (2024-03-26),
7. 11923320 - Semiconductor device having tapered metal coated sidewalls (2024-03-05),
8. 11848244 - Leaded wafer chip scale packages (2023-12-19),
9. 11601065 - Power converter module (2023-03-07),
10. 11410875 - Fan-out electronic device (2022-08-09),
11. 11387179 - IC package with half-bridge power module (2022-07-12),
12. 11183460 - Embedded die packaging with integrated ceramic substrate (2021-11-23),
13. 11183441 - Stress buffer layer in embedded package (2021-11-23),
14. 11158595 - Embedded die package multichip module (2021-10-26),
15. 10879144 - Semiconductor package with multilayer mold (2020-12-29),

Title: Innovations and Contributions of Kengo Aoya in Semiconductor Technology

Introduction: Kengo Aoya is a prominent inventor based in Oita, Japan, recognized for his significant contributions to semiconductor technology. With a remarkable portfolio of 20 patents, Aoya has played a vital role in advancing the field.

Latest Patents: Among his latest innovations, Aoya has developed a patent for "Conductive members atop semiconductor packages." This innovation entails a semiconductor package that includes a semiconductor die, a mold compound, and leads with specific geometric configurations enhancing electrical connectivity. Another noteworthy patent is for the "Frame design in embedded die package," which features an embedded die package with an exposed boundary made of organic material. This design improves the arrangement and integration of integrated circuit dies.

Career Highlights: Kengo Aoya is currently affiliated with Texas Instruments Corporation, a global leader in semiconductor design and manufacturing. His role at the company allows him to apply his inventive expertise and contribute to cutting-edge technology development.

Collaborations: Throughout his career, Aoya has collaborated with notable colleagues, including Woochan Kim and Anindya Poddar. Their combined efforts in research and development have led to innovative solutions in the semiconductor industry.

Conclusion: Kengo Aoya's work exemplifies the spirit of innovation in semiconductor technology. As he continues to develop groundbreaking patents and collaborate with esteemed colleagues, his contributions will likely shape the future of the industry.

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