The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Aug. 30, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Woochan Kim, San Jose, CA (US);

Vivek Kishorechand Arora, San Jose, CA (US);

Makoto Shibuya, Beppu, JP;

Kengo Aoya, Beppu, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02M 3/00 (2006.01); H02M 7/00 (2006.01); H02M 7/527 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H02M 3/158 (2006.01);
U.S. Cl.
CPC ...
H02M 7/527 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H02M 3/003 (2021.05); H02M 3/1582 (2013.01); H02M 7/003 (2013.01);
Abstract

A power converter module includes power transistors and a substrate having a first surface and a second surface that opposes the first surface. A thermal pad is situated on the second surface of the substrate, and the thermal pad is configured to be thermally coupled to a heat sink. The power converter module also includes a control module mounted on a first surface of the substrate. The control module also includes control IC chips coupled to the power transistors. A first control IC chip controls a first switching level of the power converter module and a second control IC chip controls a second switching level of the power converter module. Shielding planes overlay the substrate. A first shielding plane is situated between the thermal pad and the first control IC chip and a second shielding plane is situated between the thermal pad and a second control IC chip.


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