Company Filing History:

7 out of 51,873

General Electric Company

patents

5 out of 5,259

Lockheed Martin Corporation

Years Active: 2000-2012

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16 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 8120173 - Thin embedded active IC circuit integration techniques for flexible and rigid circuits (2012-02-21),

2. 8119497 - Thin embedded active IC circuit integration techniques for flexible and rigid circuits (2012-02-21),

3. RE41673 - Micro electromechanical system controlled organic LED and pixel arrays and method of using and of manufacturing same (2010-09-13),

4. 7369727 - Apparatus for coupling electromagnetic energy and method of making (2008-05-06),

5. 7212140 - Photonic analog-to-digital converters using photonic crystals (2007-05-01),

6. 7054599 - High density interconnect structure for use on software defined radio (2006-05-30),

7. 6956796 - High-capacity optical read/write pick-up mechanism and associated methods (2005-10-18),

8. 6943495 - Micro electro mechanical system controlled organic LED and pixel arrays and method of using and of manufacturing same (2005-09-13),

9. 6912183 - High-speed optical read/write pick-up mechanisms and associated methods (2005-06-28),

10. 6865307 - Method for forming an optical printed circuit board (2005-03-08),

11. 6839472 - Solid state optical interconnect system (2005-01-04),

12. 6677709 - Micro electromechanical system controlled organic led and pixel arrays and method of using and of manufacturing same (2004-01-13),

13. 6643592 - System and method for fault diagnosis (2003-11-04),

14. 6259831 - All-optical interconnect utilizing polarization gates (2001-07-10),

15. 6215516 - Method and apparatus for monoscopic to stereoscopic image conversion (2001-04-10),

Title: Innovations of Inventor Kelvin Ma

Introduction

Kelvin Ma is a prominent inventor based in Clifton Park, NY (US), known for his significant contributions to the field of electronic circuit integration. With a total of 16 patents to his name, he has made remarkable advancements in the development of flexible and rigid circuits.

Latest Patents

One of his latest patents focuses on thin embedded active IC circuit integration techniques for flexible and rigid circuits. This innovative design involves a flexible electronic circuit member composed of multiple dielectric layers, which incorporates a variety of thinned semiconductor chips. These chips are embedded within the circuit member to enhance integration levels and component density. The thinned semiconductor chips can feature various integrated circuits and are formed on different substrates using diverse technologies. They are interconnected by a patterned interconnect that extends through the dielectric layers. The method for creating this flexible circuit member includes attaching conventional semiconductor chips to a mounting apparatus, followed by grinding them to produce thinned semiconductor chips. These chips are then joined to the dielectric layers, ultimately forming the electronic circuit member.

Career Highlights

Throughout his career, Kelvin Ma has worked with notable companies such as General Electric Company and Lockheed Martin Corporation. His experience in these leading organizations has contributed to his expertise in the field of electronic engineering and circuit design.

Collaborations

Kelvin has collaborated with several professionals in his field, including Glenn A. Forman and Ji-Ung Lee. These partnerships have likely fostered innovation and the exchange of ideas, further enhancing his contributions to technology.

Conclusion

Kelvin Ma's work in the realm of electronic circuit integration showcases his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving the efficiency and functionality of electronic devices.

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1 patent (EPO):

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