The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2005

Filed:

Jul. 16, 2003
Applicants:

Kelvin MA, Clifton Park, NY (US);

Todd R. Tolliver, Clifton Park, NY (US);

John J. Soderberg, Acworth, GA (US);

Inventors:

Kelvin Ma, Clifton Park, NY (US);

Todd R. Tolliver, Clifton Park, NY (US);

John J. Soderberg, Acworth, GA (US);

Assignee:

Lockheed Martin Corporation, Bethesda, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B006/12 ; G02B006/132 ; G02B006/10 ; G02B006/26 ; B44C001/00 ;
U.S. Cl.
CPC ...
Abstract

According to one embodiment of the invention, a method includes providing a printed circuit board having a plurality of optoelectronic components coupled to a first side of the printed circuit board, forming a first clad layer outwardly from the first side of the printed circuit board, coupling an injection molding mold to the first side of the printed circuit board, injecting a material into the mold in liquid form, and after the material is solidified, decoupling the injection molding mold from the first side of the printed circuit board, thereby forming an optical waveguide outwardly from the first clad layer. The method may also include forming a second clad layer outwardly from the optical waveguide, and forming a metal layer outwardly from the second clad layer. In lieu of injection molding, stamping may be performed to form the core layer of the optical waveguide.


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