General Electric Company

Lockheed Martin Corporation

Reveo, Inc.

Boe Technology Group Co., Ltd.

Kelvin Ma

Glenn A Forman

Anil Raj Duggal

John Jesse Soderberg

Ji-Ung Lee

Sadeg Mustafa Faris

David C Swift

Steven J Kane

Sanjay Tripathi

Matthew Christian Nielsen

Samhita Dasgupta

Richard Louis Frey

Min-Yi Shih

Todd Ryan Tolliver

Michael Joseph Mahony

James Mark Loman

Jeannine Jones

D T George Lu

David Wayne Riffel

Dt George Lu

A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining conventional semiconductor chips to a mounting apparatus then grinding the semiconductor chips to form thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member. A releasable bonding layer is used to join the semiconductor chip to a mounting assembly during the grinding operation and removed after the thinned semiconductor chips are joined to the respective dielectric layers used in combination to form the electronic circuit member.

Thin embedded active IC circuit integration techniques for flexible and rigid circuits

A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining semiconductor chips to a mounting apparatus using a releasable bonding layer then forming thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member. The releasable bonding layer is removed after the thinned semiconductor chips are joined to the respective dielectric layers used in combination to form the electronic circuit member.

Organic light emitting devices are disclosed that use a micro electromechanical system (MEMS) structure to enable a pixel and pixel array wherein each pixel contains a MEMS and an OLED element. A MEMS structure is used for switching the OLED element. These OLED/MEMS pixels can be fabricated on flex circuit, silicon, as well as other inorganic materials. They can be fabricated in a large array for developing a 2-dimensional display application and each pixel can be addressed through conventional matrix scanning addressing scheme. The ability of fabricating these OLED/MEMS pixels on flexible organic substrates as well as other rigid substrates enables wider selection of substrate materials for use with different applications.

Micro electromechanical system controlled organic LED and pixel arrays and method of using and of manufacturing same

An electromagnetic coupler comprising: a coupling waveguide adapted for receiving input modes along an input axis, propagating coupling modes along a coupling axis, and transmitting output modes along an output axis, the output axis being not parallel to the coupling axis; and an output waveguide disposed adjacent the coupling waveguide and adapted for receiving the output modes.

Apparatus for coupling electromagnetic energy and method of making

A system and method for quantizing a photonic signal involves passing the photonic signal through a photonic crystal. The photonic crystal has localized defects for splitting the photonic signal into a plurality of quantized photonic components and for directing the quantized photonic components to a set of optical detectors. A digital conversion of the photonic signal can occur by performing a threshold comparison of the quantized components, either in the electrical domain through comparators or in the optical domain through optical limiters.

Photonic analog-to-digital converters using photonic crystals

A radio and method of making the radio is disclosed having a first set of radio components for processing analog signals in a radio transmission and a second set of radio components for processing digital signals in a radio transmission. The radio comprises a substrate base support, and at least one pocket formed within the substrate. The radio comprises at least one processor, each of the at least one processor being within a corresponding one of the at least one pocket for modulating a radio signal into one of a plurality of waveforms based on a software instruction set. Each of the at least one processor being in electronic communication with both of the first and second sets of the radio components. A dielectric layer covers a top surface of the substrate and each of the at least one processor. A plurality of vias are formed in the dielectric layer to expose selected portions of each of the at least one processor. A metallization layer is formed over the dielectric layer and over the plurality of vias so that each of the at least one processor is in electrical communication with the first and second sets of radio components.

High density interconnect structure for use on software defined radio

High-capacity pick-up mechanisms operable for selectively reading data from and/or writing data to one or more surfaces of one or more optical storage media are disclosed. These mechanisms comprise a first pivotable structure, a second pivotable structure, a first reflective element, a second reflective element, a light source, and a light receiving device. The light source and the light receiving device are remotely located from the reflective elements via the pivotable structures, and only the reflective elements and a portion of the pivotable structure are positioned adjacent the surface of an optical storage medium. High-capacity optical read/write devices and systems comprising these high-capacity pick-up mechanisms are also disclosed.

High-capacity optical read/write pick-up mechanism and associated methods

Micro electro mechanical system controlled organic LED and pixel arrays and method of using and of manufacturing same

High-speed pick-up mechanisms operable for reading data from and/or writing data to an optical storage medium are disclosed. These mechanisms comprise a pivotable structure, a reflective element, a light source, a light receiving device, and an actuation device. The light source and the light receiving device are remotely located from the reflective element via the pivotable structure, and only the reflective element and a portion of the pivotable structure are positioned adjacent the surface of an optical storage medium. High-speed optical read/write devices and systems comprising these high-speed pick-up mechanisms are also disclosed. Additionally, high-speed methods for reading data from and/or writing data to an optical storage medium are disclosed.

High-speed optical read/write pick-up mechanisms and associated methods

According to one embodiment of the invention, a method includes providing a printed circuit board having a plurality of optoelectronic components coupled to a first side of the printed circuit board, forming a first clad layer outwardly from the first side of the printed circuit board, coupling an injection molding mold to the first side of the printed circuit board, injecting a material into the mold in liquid form, and after the material is solidified, decoupling the injection molding mold from the first side of the printed circuit board, thereby forming an optical waveguide outwardly from the first clad layer. The method may also include forming a second clad layer outwardly from the optical waveguide, and forming a metal layer outwardly from the second clad layer. In lieu of injection molding, stamping may be performed to form the core layer of the optical waveguide.

Method for forming an optical printed circuit board

A solid state optical interconnect system selectively interconnects a plurality of electromagnetic signals between a plurality of inputs and a plurality of outputs. The system includes a plurality of solid state, selectively actuatable 2&#xd7;2 optical switching elements; and a plurality of all-optical signal paths extending through said 2&#xd7;2 optical switching elements between the inputs and outputs. Each of said plurality of all-optical signal paths has substantially the same pathlength. This switch element is relatively robust and insensitive to environmental disturbances and has a reconfiguration time which is an order of magnitude faster than conventional opto-mechanical switches which generally require tens of milliseconds before reconfiguration. The switch element provides constant data pathlength for constant latency, loss, and unskewed data output. The element also advantageously provides for convenient scaling to a non-blocking N&#xd7;N configuration using N*(logN&#x2212;) 2&#xd7;2 switches rather than conventional approaches which require N(logN) switches, for a relatively simple and compact configuration.

Solid state optical interconnect system

Micro electromechanical system controlled organic led and pixel arrays and method of using and of manufacturing same

A method and system for accessing a remote site by a field engineer faced with a machine fault. The remote site includes various expert systems and fault prediction tools to assist the field engineer. In the event the field engineer is unable to diagnose the fault and repair the machine the machine is returned to a repair center, accompanied by an automatically generated return code that identifies the various analysis conducted by the field engineer and the potential fault causes identified during that analysis process.

System and method for fault diagnosis

A switch element utilizes a single polarizer to couple two discreet inputs to any combination of two discreet outputs along non-blocking optical paths. This switch element may be conveniently networked to additional switch elements for scaling to switches having larger numbers (N) of inputs and outputs. The present invention provides advantages typically associated with conventional polarization gates, including terabit per-second data rates, to facilitate use in fiber-optics networks. This switch element is relatively robust and insensitive to environmental disturbances and has a reconfiguration time which is an order of magnitude faster than conventional optomechanical switches which generally require tens of milliseconds before reconfiguration. The switch element provides constant data pathlength for constant latency, loss, and unskewed data output. The element also advantageously provides for convenient scaling to a non-blocking N&times;N configuration using N* (log,N&minus;,),switches rather than conventional approaches which require N(log,N) switches, for a relatively simple and compact configuration.

All-optical interconnect utilizing polarization gates

A method and apparatus for converting a monoscopic image with one perspective to a stereoscopic image with two perspectives is provided. A foreground object is identified and outlined. The depth of the object is endowed with depth information. The second perspective is generated by image warping. Alternate embodiments comprising additional features, such as removing redundant frames, which reduce the necessary computation are also provided.

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Clifton Park, NY, United States of America

Kelvin Ma