The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2012
Filed:
Oct. 31, 2007
Glenn Alan Forman, Niskayuna, NY (US);
Kelvin MA, Clifton Park, NY (US);
Glenn Alan Forman, Niskayuna, NY (US);
Kelvin Ma, Clifton Park, NY (US);
Lockheed Martin Corporation, Bethesda, MD (US);
Abstract
A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining semiconductor chips to a mounting apparatus using a releasable bonding layer then forming thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member. The releasable bonding layer is removed after the thinned semiconductor chips are joined to the respective dielectric layers used in combination to form the electronic circuit member.