Keith L Barrie

Title: **Innovations by Keith L. Barrie: Pioneering Electrical Connector Technologies**

Introduction

Keith L. Barrie, an accomplished inventor based in Capitola, California, has made significant contributions to the field of semiconductor technology. With a total of three patents to his name, Barrie's work emphasizes innovative approaches to electrical connectors in stacked die assemblies, showcasing his expertise in materials and processing techniques.

Latest Patents

Barrie's latest patent focuses on the development of an electrical connector between the die pad and the z-interconnect for stacked die assemblies. This invention involves methods for forming connectors on die pads at a wafer level. It includes the formation of spots of curable electrically conductive material over die pads, which extend to or over the interconnect die edge. The conductive material is cured, and during the wafer cutting process, the spots are severed, allowing for optimized connections. This innovative method not only introduces die pad to z-interconnect connectors shaped and dimensioned appropriately but is also integral to the creation of stacked die assemblies and packages that incorporate these advanced connectors.

Career Highlights

He is associated with Adeia Semiconductor Bonding Technologies Inc., a leading company in semiconductor bonding solutions. Barrie's work is pivotal in advancing the industry's capabilities, as his inventions facilitate the efficient production of cutting-edge semiconductor devices.

Collaborations

Throughout his career, Barrie has collaborated with talented colleagues, including Jeffrey S. Leal and Grant Villavicencio. These partnerships have fostered a creative environment that encourages innovative advancements in semiconductor technologies.

Conclusion

In summary, Keith L. Barrie stands out as a notable figure in the realm of electrical connector technologies. His groundbreaking patents and collaborative efforts underscore his commitment to innovation within the semiconductor field, driving progress and enhancing the efficiency of stacked die assemblies. As technology continues to advance, Barrie’s contributions are likely to have a lasting impact on the industry.