The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Sep. 23, 2011
Keith Lake Barrie, Santa Cruz, CA (US);
Suzette K. Pangrie, Cupertino, CA (US);
Grant Villavicencio, Scotts Valley, CA (US);
Jeffrey S. Leal, Scotts Valley, CA (US);
Keith Lake Barrie, Santa Cruz, CA (US);
Suzette K. Pangrie, Cupertino, CA (US);
Grant Villavicencio, Scotts Valley, CA (US);
Jeffrey S. Leal, Scotts Valley, CA (US);
Invensas Corporation, San Jose, CA (US);
Abstract
A die has interconnect pads on an interconnect side near an interconnect edge and has at least a portion of the interconnect side covered by a conformal dielectric coating, in which an interconnect trace over the dielectric coating forms a high interface angle with the surface of the dielectric coating. Because the traces have a high interface angle, a tendency for the interconnect materials to 'bleed' laterally is mitigated and contact or overlap of adjacent traces is avoided. The interconnect trace includes a curable electrically conductive interconnect material; that is, it includes a material that can be applied in a flowable form, and thereafter cured or allowed to cure to form the conductive traces. Also, a method includes, prior to forming the traces, subjecting the surface of the conformal dielectric coating with a CFplasma treatment.