Kazushi Kataoka

Title: Kazushi Kataoka: Innovator in Wafer Level Packaging

Introduction

Kazushi Kataoka is a distinguished inventor based in Neyagawa, Japan, known for his significant contributions to the field of wafer level packaging. With a total of six patents to his name, Kataoka has been instrumental in developing innovative structures and methods that enhance sensor technologies.

Latest Patents

Among Kataoka's latest inventions are advancements in wafer level package structures and associated production methods. One of his notable patents describes a wafer level package structure that features multiple compact sensor devices with minimal variations in sensor characteristics. This design incorporates a semiconductor wafer embedded with several sensor units, complemented by a package wafer that is bonded to it. The unique aspect of this structure is the first metal layer present on the semiconductor wafer, which interacts with a bonding metal layer on the package wafer to ensure room temperature bonding. This method significantly reduces the risk of variations in sensor characteristics that could arise from residual stress at the bonding interface.

Another groundbreaking patent of his involves a wafer level package structure that hosts numerous compact sensors, such as acceleration sensors and gyro sensors. This innovative packaging is composed of a semiconductor wafer that holds multiple sensor units, with two package wafers attached to both sides. Each sensor unit is designed with a frame containing an opening, allowing a movable portion to detect positional displacements accurately. The solid-phase direct bonding process employed here is critical as it prevents characteristic variations due to residual stress, ensuring reliable sensor performance.

Career Highlights

Kataoka’s professional journey includes significant roles at leading companies in the electronics sector. He has prominently worked with Panasonic Electric Works Co., Ltd. and Matsushita Electric Works, Ltd., where he contributed to advancements in sensor technology and packaging innovation.

Collaborations

Throughout his career, Kataoka has collaborated with fellow innovators, including Hisakazu Miyajima and Takafumi Okudo. These partnerships have fostered a creative environment that has led to the development of cutting-edge technologies in the sensor industry.

Conclusion

Kazushi Kataoka stands out as a remarkable inventor whose work in wafer level packaging continues to influence the industry significantly. His latest patents reflect not only his ingenuity but also his commitment to addressing the challenges in sensor technology. As he continues to innovate, the impact of his work will likely resonate within the tech community for years to come.