The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Nov. 24, 2006
Takafumi Okudo, Nara, JP;
Yuji Suzuki, Hirakata, JP;
Yoshiyuki Takegawa, Nara, JP;
Toru Baba, Osaka, JP;
Kouji Gotou, Neyagawa, JP;
Hisakazu Miyajima, Osaka, JP;
Kazushi Kataoka, Neyagawa, JP;
Takashi Saijo, Kawanishi, JP;
Takafumi Okudo, Nara, JP;
Yuji Suzuki, Hirakata, JP;
Yoshiyuki Takegawa, Nara, JP;
Toru Baba, Osaka, JP;
Kouji Gotou, Neyagawa, JP;
Hisakazu Miyajima, Osaka, JP;
Kazushi Kataoka, Neyagawa, JP;
Takashi Saijo, Kawanishi, JP;
Panasonic Electric Works Co., Ltd., Osaka, JP;
Abstract
A compact sensor device having stable sensor characteristics and the production method are provided. The sensor device is formed with a sensor substrate and a pair of package substrates bonded to both surface of the sensor substrate. The sensor substrate has a frame with an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Surface-activated regions are formed on the frame of the sensor substrate and the package substrates by use of an atomic beam, an ion beam or a plasma of an inert gas. By forming a direct bonding between the surface-activated regions of the sensor substrate and each of the package substrates at room temperature, it is possible to avoid inconvenience resulting from residual stress at the bonding portion.