The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2011
Filed:
Nov. 24, 2006
Takafumi Okudo, Nara, JP;
Yuji Suzuki, Hirakata, JP;
Yoshiyuki Takegawa, Nara, JP;
Toru Baba, Osaka, JP;
Kouji Gotou, Neyagawa, JP;
Hisakazu Miyajima, Osaka, JP;
Kazushi Kataoka, Neyagawa, JP;
Takashi Saijo, Kawanishi, JP;
Takafumi Okudo, Nara, JP;
Yuji Suzuki, Hirakata, JP;
Yoshiyuki Takegawa, Nara, JP;
Toru Baba, Osaka, JP;
Kouji Gotou, Neyagawa, JP;
Hisakazu Miyajima, Osaka, JP;
Kazushi Kataoka, Neyagawa, JP;
Takashi Saijo, Kawanishi, JP;
Panasonic Electric Works Co., Ltd., Osaka, JP;
Abstract
A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface.