Kazuhiko Ooi

Title: Kazuhiko Ooi: Innovator in Semiconductor Packaging

Introduction

Kazuhiko Ooi is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the reliability and durability of semiconductor devices.

Latest Patents

Kazuhiko Ooi's latest patents include innovative designs for packages used in semiconductor devices. One of his patents addresses the prevention of stress in the junction portion between the semiconductor element and the package. This design aims to alleviate the occurrence of cracks, even when a semiconductor element with low strength is mounted. The package is constructed as a laminate of multiple layers, including conducting and insulating resin layers, which are alternately laminated. The insulating resin layers are made from a prepreg obtained by impregnating a woven fabric of liquid crystal polymer with an insulating resin.

Another patent by Ooi also focuses on preventing stress in the junction area, ensuring that cracks do not occur when mounting semiconductor elements with small strength. This design similarly features a laminate structure with alternating conducting and insulating layers, enhancing the overall performance and reliability of semiconductor devices.

Career Highlights

Kazuhiko Ooi is currently employed at Shinko Electric Industries Co., Ltd. His work at this company has allowed him to develop and refine his innovative approaches to semiconductor packaging. His contributions have been instrumental in advancing the technology used in this critical area of electronics.

Collaborations

Throughout his career, Kazuhiko Ooi has collaborated with notable colleagues, including Tadashi Kodaira and Eisaku Watari. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in semiconductor packaging.

Conclusion

Kazuhiko Ooi's work in semiconductor packaging exemplifies innovation and dedication to improving technology. His patents reflect a commitment to enhancing the reliability of semiconductor devices, making significant strides in the industry.