The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2004
Filed:
May. 13, 2003
Kazuhiko Ooi, Nagano, JP;
Masaru Yamazaki, Nagano, JP;
Yukiji Watanabe, Nagano, JP;
Takaaki Yazawa, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A metal core substrate comprises a core layer ( ) consisting of first and second metal plates ( ) layered with a third insulating layer ( ) interposed therebetween; first and second insulating layers ( ) formed on the first and metal plates, respectively; first and second wiring patterns ( ) formed on the first and second insulating layers, respectively. A conductive layer ( ) formed in a through-hole ( ) penetrates the first insulating layer, the first metal plate, the third insulating layer, the second metal plate and the second insulating layer for electrically connecting the first wiring pattern with the second wiring pattern. The first metal plate ( ) is electrically connected with the first wiring pattern ( ) and the second wiring pattern ( ), respectively, by means of a via ( ) and by means a via ( ). The second metal plate ( ) is electrically connected with the second wiring pattern ( ) and the first wiring pattern ( ), respectively, by means of a via ( ) and by means a via ( ), respectively.