Takaaki Yazawa

Title: Takaaki Yazawa: Innovator in Multilayer Printed Wiring Board Technology

Introduction

Takaaki Yazawa is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of multilayer printed wiring boards, holding three patents that showcase his innovative methods and techniques.

Latest Patents

Yazawa's latest patents focus on the production method of multilayer printed wiring boards. His innovative approach involves forming a via hole by laser irradiation in an insulating layer made from a prepreg, which consists of glass cloth impregnated with a thermosetting resin composition. The via hole undergoes a glass etching treatment with a glass etching solution, followed by a desmear treatment using an oxidizing agent solution. This process effectively suppresses the etch back phenomenon and excessive protrusion of glass cloth from the wall surface of the via hole, allowing for the formation of highly reliable vias. Notably, this method enables the creation of small via holes with a top diameter of 75 micrometers or below.

Career Highlights

Throughout his career, Takaaki Yazawa has worked with prominent companies such as Shinko Electric Industries Co., Ltd. and Ajinomoto Co., Ltd. His experience in these organizations has contributed to his expertise in the field of printed wiring board technology.

Collaborations

Yazawa has collaborated with esteemed colleagues, including Seiichiro Ohashi and Eiichi Hayashi. These partnerships have further enriched his work and innovations in the industry.

Conclusion

Takaaki Yazawa's contributions to multilayer printed wiring board technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in creating reliable electronic components.