Katsumi Otani

Title: The Innovations of Katsumi Otani

Introduction

Katsumi Otani is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on developing advanced semiconductor devices that enhance performance and reliability.

Latest Patents

One of Katsumi Otani's latest patents is a semiconductor device and method for manufacturing the same. This invention describes a surface mount-type semiconductor device that includes a nitride semiconductor chip. The chip features a silicon substrate with a specific thermal expansion coefficient and an InGaAlN layer in contact with the silicon surface. The design ensures that the thickness of the nitride semiconductor chip is at least 0.2 mm, and the length of the chip is a minimum of 3.12 mm. Additionally, the die pad, made of copper, has a greater thermal expansion coefficient than the silicon substrate, which is crucial for maintaining device integrity under varying temperatures.

Career Highlights

Katsumi Otani has had a distinguished career, working with notable companies such as Panasonic Corporation and Panasonic Intellectual Property Management Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Throughout his career, Katsumi has collaborated with esteemed colleagues, including Hidekazu Nakamura and Manabu Yanagihara. These partnerships have fostered a creative environment that has led to the development of innovative solutions in the semiconductor field.

Conclusion

Katsumi Otani's contributions to semiconductor technology are noteworthy, with several patents that reflect his expertise and innovative spirit. His work continues to influence the industry, paving the way for future advancements in semiconductor devices.