The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2014

Filed:

Jan. 27, 2012
Applicants:

Subaru Matsumoto, Osaka, JP;

Kou Komori, Nara, JP;

Daisuke Katayama, Kyoto, JP;

Katsumi Otani, Osaka, JP;

Inventors:

Subaru Matsumoto, Osaka, JP;

Kou Komori, Nara, JP;

Daisuke Katayama, Kyoto, JP;

Katsumi Otani, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat generating component () is mounted on one surface of a circuit board (). A heat release member () is disposed between the one surface and an opposite wall () of a housing (). The heat release member () has a plate () that extends in a specified direction and is in contact with the heat generating component (), and fins () that project from the plate () toward the opposite wall (). In a region of the opposite wall () of the housing overlapping with the heat release member (), an air inlet () is provided so as to extend in the specified direction. The heat release member () is, at both end portions thereof in the specified direction, in contact with the opposite wall () via heat-conductive spacers (), and a gap () is formed between the fins () and the opposite wall ().


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