The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2015
Filed:
Dec. 02, 2014
Applicant:
Panasonic Corporation, Osaka, JP;
Inventors:
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/433 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/3142 (2013.01); H01L 23/3677 (2013.01); H01L 23/4334 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 23/3121 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/45 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/1626 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4826 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A semiconductor device includes a substrate serving as a base and having a surface on which electrodes are provided, a semiconductor chip mounted to the surface of the substrate, a sealing portion sealing the semiconductor chip and the surface of the substrate, first vias each penetrating the sealing portion in a thickness direction of the sealing portion to reach the electrodes on the surface of the substrate, external terminals connected to the first vias, and second vias provided near the semiconductor chip, extending to such a depth that the second vias do not penetrate the sealing portion, and insulated from the substrate and the semiconductor chip.