The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2011

Filed:

Mar. 04, 2008
Applicant:

Katsumi Otani, Osaka, JP;

Inventor:

Katsumi Otani, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a semiconductor element, a thermal conductorlocated opposite a major surface of the semiconductor element, and a mold resin membermolding the semiconductor elementand at least a part of the thermal conductor, wherein at least a part of a top surface of the thermal conductorhas an exposed portion exposed from the mold resin member, the exposed portion of the thermal conductorhas an opening, and a periphery of the openingforms a projecting portionprojecting toward an opposite side of the semiconductor element


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