IDiyas

For the Inventor, By the Inventor

Neipu, Taiwan

Kai Tzeng

USPTO Granted Patents = 13 

Average Co-Inventor Count = 4.4

ph-index = 3

Forward Citations = 21(Granted Patents)


Location History:

  • Ping-Tung, TW (2005)
  • Ping-Pong Nei-Pui, TW (2013 - 2016)
  • Pingtung County, TW (2019)
  • Neipu Township, TW (2018 - 2021)
  • Hsin-Chu, TW (2018 - 2021)

Company Filing History:

goldMedal13 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2005-2025

Loading Chart...
13 patents (USPTO):Explore Patents
1. 12426284 - Semiconductor device with inductive component and method of forming (2025-09-23),
2. 11139239 - Recessed inductor structure to reduce step height (2021-10-05),
3. 11086221 - Method of using a surfactant-containing shrinkage material to prevent photoresist pattern collapse caused by capillary forces (2021-08-10),
4. 10734436 - Method of using a surfactant-containing shrinkage material to prevent photoresist pattern collapse caused by capillary forces (2020-08-04),
5. 10546889 - Method of high-aspect ratio pattern formation with submicron pixel pitch (2020-01-28),
6. 10186542 - Patterning for substrate fabrication (2019-01-22),
7. 10121811 - Method of high-aspect ratio pattern formation with submicron pixel pitch (2018-11-06),
8. 10090357 - Method of using a surfactant-containing shrinkage material to prevent photoresist pattern collapse caused by capillary forces (2018-10-02),
9. 9401384 - Method of preparing self-aligned isolation regions between sensor elements (2016-07-26),
10. 9171876 - Self-aligned implants to reduce cross-talk of imaging sensors (2015-10-27),
11. 8766406 - Self-aligned implants to reduce cross-talk of imaging sensors (2014-07-01),
12. 8367512 - Self-aligned implants to reduce cross-talk of imaging sensors (2013-02-05),
13. 6951803 - Method to prevent passivation layer peeling in a solder bump formation process (2005-10-04),

Title: Innovations of Inventor Kai Tzeng

Introduction

Kai Tzeng is a prominent inventor based in Neipu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work focuses on innovative methods for forming semiconductor devices, which are crucial for modern electronics.

Latest Patents

One of his latest patents is titled "Semiconductor device with inductive component and method of forming." This patent describes a method that includes forming a passivation layer over a conductive pad and creating an inductive component over this layer. The process involves multiple steps, including the formation of insulation and magnetic layers, as well as polymer layers that enhance the device's functionality.

Another notable patent is "Recessed inductor structure to reduce step height." This invention pertains to an integrated circuit (IC) that features an interconnect structure with several metal layers. The design includes a trench defined by a dielectric layer, which houses a magnetic layer and conductive wires, optimizing the performance of the IC.

Career Highlights

Kai Tzeng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in semiconductor devices has positioned him as a key player in the development of advanced technologies.

Collaborations

Throughout his career, Tzeng has collaborated with notable colleagues, including Wei-Chao Chiu and Chih-Chien Wang. These partnerships have fostered innovation and contributed to the success of various projects within the semiconductor field.

Conclusion

Kai Tzeng's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to shape the future of electronics and semiconductor devices.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…