The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Mar. 07, 2016
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Wei-Chao Chiu, Hsinchu, TW;

Chih-Chien Wang, Changhua, TW;

Feng-Jia Shiu, Jhudong Township, TW;

Ching-Sen Kuo, Taipei, TW;

Chun-Wei Chang, Tainan, TW;

Kai Tzeng, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/38 (2006.01); H01L 27/146 (2006.01); G03F 7/16 (2006.01); G03F 7/32 (2006.01); H01L 21/027 (2006.01); H01L 21/266 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14683 (2013.01); G03F 7/168 (2013.01); G03F 7/32 (2013.01); G03F 7/38 (2013.01); H01L 21/0273 (2013.01); H01L 21/266 (2013.01); H01L 21/31144 (2013.01); H01L 21/76802 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01);
Abstract

A first photoresist pattern and a second photoresist pattern are formed over a substrate. The first photoresist pattern is separated from the second photoresist pattern by a gap. A chemical mixture is coated on the first and second photoresist patterns. The chemical mixture contains a chemical material and surfactant particles mixed into the chemical material. The chemical mixture fills the gap. A baking process is performed on the first and second photoresist patterns, the baking process causing the gap to shrink. At least some surfactant particles are disposed at sidewall boundaries of the gap. A developing process is performed on the first and second photoresist patterns. The developing process removes the chemical mixture in the gap and over the photoresist patterns. The surfactant particles disposed at sidewall boundaries of the gap reduce a capillary effect during the developing process.


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