This inventor holds 17 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2019-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019-2026
Areas of Expertise:
Title: The Innovative Contributions of Jyun-Siang Peng
Introduction
Jyun-Siang Peng is a prominent inventor based in Hsinchu, Taiwan, known for his significant contributions to semiconductor technology. With a remarkable portfolio of 14 patents, he has been instrumental in creating advanced packaging solutions that enhance the performance and reliability of integrated circuits.
Latest Patents
Peng's latest innovations include a patent for a package structure and method of fabricating the same. This package structure features at least one semiconductor die, which incorporates a plurality of conductive posts with a distinct surface roughness. The insulating encapsulant that houses the semiconductor die contributes to the overall integrity of the package. Another notable patent details a method for fabricating an integrated fan-out package, which involves encapsulating an integrated circuit component with an insulating layer and forming a redistribution circuit structure. This innovative approach includes a dielectric layer with conductive vias, aimed at improving the package's electrical performance.
Career Highlights
Currently, Jyun-Siang Peng is associated with Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading player in the semiconductor manufacturing industry. His work focuses on developing cutting-edge packaging technologies that are essential for modern electronic devices.
Collaborations
In his innovative journey, Peng has collaborated with esteemed colleagues such as Hung-Jui Kuo and Hui-Jung Tsai. Together, they have worked on various projects that reinforce TSMC's position as a pioneer in semiconductor packaging and fabrication methods.
Conclusion
Jyun-Siang Peng's inventive spirit and technical expertise continue to push the boundaries of semiconductor technologies. His patents not only contribute to advancements in packaging solutions but also pave the way for more efficient and robust electronic systems. With ongoing innovations, Peng remains a key figure in the evolution of the semiconductor landscape.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile