The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Jun. 17, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
The present disclosure provides a method of manufacturing a semiconductor package. Semiconductor dies having conductive pillars are provided and are encapsulated with an insulating encapsulant. A redistribution circuit structure is formed on the insulating encapsulant and the semiconductor dies, and the redistribution circuit structure is electrically connected to the semiconductor dies. A photosensitive mask pattern having a plurality of openings is formed. A plurality of conductive vias is formed within the openings of the photosensitive mask pattern. A dielectric layer is then formed, and the conductive vias are embedded in the dielectric layer.