Company Filing History:
Years Active: 2013-2018
Title: Innovations of Junping Wu in Semiconductor Cleaning Technologies
Introduction
Junping Wu is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, particularly in the area of cleaning semiconductor wafers. With a total of five patents to his name, his work has advanced the methods used in semiconductor manufacturing.
Latest Patents
One of Junping Wu's latest patents is focused on methods and apparatus for cleaning semiconductor wafers. This innovative method utilizes an ultra/mega sonic device to clean semiconductor substrates effectively. The process involves holding the semiconductor substrate with a chuck and positioning the ultra/mega sonic device adjacent to it. Chemical liquid is injected onto the substrate and the gap between the substrate and the device. The gap is adjusted for each rotation of the chuck, allowing for a more thorough cleaning process. The gap can be varied by 0.5/N for each rotation, where N is an integer between 2 and 1000. This method ensures that the cleaning is efficient and effective, enhancing the quality of semiconductor wafers.
Career Highlights
Junping Wu is currently employed at ACM Research (Shanghai) Inc., where he continues to innovate in the semiconductor field. His work has been instrumental in developing advanced cleaning techniques that are crucial for the production of high-quality semiconductor devices.
Collaborations
He collaborates with notable colleagues such as Jian Wang and Zhaowei Jia, contributing to a dynamic research environment that fosters innovation and technological advancement.
Conclusion
Junping Wu's contributions to semiconductor cleaning technologies exemplify the importance of innovation in the tech industry. His patents reflect a commitment to improving manufacturing processes, which is vital for the advancement of semiconductor technology.
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