The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Sep. 30, 2016
Applicant:

Acm Research (Shanghai) Inc., Shanghai, CN;

Inventors:

Jian Wang, Shanghai, CN;

Sunny Voha Nuch, Shanghai, CN;

Liangzhi Xie, Shanghai, CN;

Junping Wu, Shanghai, CN;

Zhaowei Jia, Shanghai, CN;

Yunwen Huang, Shanghai, CN;

Zhifeng Gao, Shanghai, CN;

Yue Ma, Shanghai, CN;

Hui Wang, Shanghai, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); B08B 3/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02068 (2013.01); B08B 3/12 (2013.01); H01L 21/67051 (2013.01);
Abstract

A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process by turn the semiconductor substrate or the ultra/mega sonic device clockwise or counter clockwise.


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