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For the Inventor, By the Inventor

Yongin-si, South Korea

Jun-sik Hwang

USPTO Granted Patents = 26 

Average Co-Inventor Count = 4.7

ph-index = 7

Forward Citations = 134(Granted Patents)


Location History:

  • Osan, KR (2008)
  • Yongin-si, KR (2008 - 2011)
  • Ohsan-si, KR (2006 - 2013)
  • Hwaseong-si, KR (2012 - 2015)

Company Filing History:

goldMedal24 out of 131,611 
 
Samsung Electronics Co., Ltd.
 patents
silverMedal2 out of 7,593 
 
Samsung Electro-mechanics Co., Ltd.
 patents

Years Active: 2006-2015

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26 patents (USPTO):Explore Patents
1. 9041999 - Electrowetting device and method of manufacturing the same (2015-05-26),
2. 8958595 - Piezoelectric micro speaker having piston diaphragm and method of manufacturing the same (2015-02-17),
3. 8901598 - Light emitting device (2014-12-02),
4. 8526642 - Piezoelectric micro speaker including weight attached to vibrating membrane and method of manufacturing the same (2013-09-03),
5. 8509462 - Piezoelectric micro speaker including annular ring-shaped vibrating membranes and method of manufacturing the piezoelectric micro speaker (2013-08-13),
6. 8418331 - Method of fabricating a duplexer using an embedded PCB (2013-04-16),
7. 8401220 - Piezoelectric micro speaker with curved lead wires and method of manufacturing the same (2013-03-19),
8. 8275158 - Piezoelectric micro speaker (2012-09-25),
9. 7963021 - Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package (2011-06-21),
10. 7893792 - Duplexer using an embedded PCB and method of fabricating the same (2011-02-22),
11. 7793395 - Method for manufacturing a film bulk acoustic resonator (2010-09-14),
12. 7755151 - Wafer level package for surface acoustic wave device and fabrication method thereof (2010-07-13),
13. 7675154 - RF module with multi-stack structure (2010-03-09),
14. 7626258 - Cap wafer, semiconductor chip having the same, and fabrication method thereof (2009-12-01),
15. 7579685 - Wafer level packaging cap and fabrication method thereof (2009-08-25),

Title: Jun-sik Hwang: Innovator in Electromechanical Technology

Introduction

Jun-sik Hwang, based in Yongin-si, South Korea, is a prominent inventor with an impressive portfolio of 26 patents. His contributions to the field of electromechanical devices have led to advancements that enhance functionality and efficiency in various technologies.

Latest Patents

Among his latest patents, Hwang developed an electrowetting device, which features a unique design including two immiscible media with distinct refractive indices. This device incorporates an upper electrode that regulates the angle of the boundary surface between the two media and is surrounded by a specially designed barrier wall with irregular widths. Additionally, he created a piezoelectric micro speaker characterized by its piston diaphragm. This innovative speaker design includes a substrate with a cavity, a vibrating membrane, and a piezoelectric actuator that together promote efficient sound production through piston motion.

Career Highlights

Hwang's professional journey includes significant tenures at Samsung Electronics Co., Ltd. and Samsung Electro-Mechanics Co., Ltd. His experience at these leading companies has equipped him with the expertise to drive innovations in the industry.

Collaborations

Throughout his career, Jun-sik Hwang has collaborated with notable colleagues such as Moon-chul Lee and Woon-bae Kim. These partnerships have fostered creativity and propelled innovative projects within their fields.

Conclusion

Jun-sik Hwang continues to pave the way for future developments in electromechanical technologies. His dedication to innovation and collaboration not only enhances the market but also inspires aspiring inventors to push the boundaries of technology.

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