The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
May. 02, 2006
Ji-hyuk Lim, Suwon-si, KR;
Jun-sik Hwang, Yongin-si, KR;
Woon-bae Kim, Suwon-si, KR;
Suk-jin Ham, Seoul, KR;
Jong-oh Kwon, Suwon-si, KR;
Moon-chul Lee, Yongin-si, KR;
Chang-youl Moon, Suwon-si, KR;
Ji-hyuk Lim, Suwon-si, KR;
Jun-sik Hwang, Yongin-si, KR;
Woon-bae Kim, Suwon-si, KR;
Suk-jin Ham, Seoul, KR;
Jong-oh Kwon, Suwon-si, KR;
Moon-chul Lee, Yongin-si, KR;
Chang-youl Moon, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A wafer level package for a surface acoustic wave device and a fabrication method thereof include a SAW device formed with a SAW element on an upper surface of a device wafer; a cap wafer joined on an upper part of the SAW element; a cavity part housing the SAW element between the cap wafer and the SAW device; a cap pad formed on an upper surface of the cap wafer; and a metal line formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.