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For the Inventor, By the Inventor

Suwon-si, South Korea

Ji-Hyuk Lim

USPTO Granted Patents = 17

 

Average Co-Inventor Count = 4.5

ph-index = 6

Forward Citations = 110(Granted Patents)


Location History:

  • Suwon-si, KR (2006 - 2014)
  • Gyeonggi-do, KR (2014)

Company Filing History:

goldMedal17 out of 131,611 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2006-2014

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17 patents (USPTO):Explore Patents
1. 8872041 - Multilayer laminate package and method of manufacturing the same (2014-10-28),
2. 8682657 - Apparatus and method for improving communication sound quality in mobile terminal (2014-03-25),
3. 8274198 - Ultrasonic motor and conveying apparatus having the same (2012-09-25),
4. 8237330 - Vibrating element, fabrication method thereof, and ultrasonic motor having the same (2012-08-07),
5. 8049396 - Piezoelectric ultrasonic motor and method of manufacturing the same (2011-11-01),
6. 8045318 - Tunable capacitor using electrowetting phenomenon (2011-10-25),
7. 7906841 - Wafer level incapsulation chip and encapsulation chip manufacturing method (2011-03-15),
8. 7755151 - Wafer level package for surface acoustic wave device and fabrication method thereof (2010-07-13),
9. 7732981 - Ultrasonic motor having lightweight vibrating element (2010-06-08),
10. 7545017 - Wafer level package for surface acoustic wave device and fabrication method thereof (2009-06-09),
11. 7449366 - Wafer level packaging cap and fabrication method thereof (2008-11-11),
12. 7374972 - Micro-package, multi-stack micro-package, and manufacturing method therefor (2008-05-20),
13. 7285865 - Micro-package, multi-stack micro-package, and manufacturing method therefor (2007-10-23),
14. 7216959 - Apparatus and method for driving an ink-jet printhead (2007-05-15),
15. 7210766 - Thermally-driven ink-jet printhead capable of preventing cavitation damage to a heater (2007-05-01),
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