Samsung Electronics Co., Ltd.

Ji-Hyuk Lim

Woon-bae Kim

Suk-jin Ham

Yong-soo Oh

Jin-woo Cho

Jong-oh Kwon

In-sang Song

Keon Kuk

Moon-chul Lee

Jun-sik Hwang

Byung-gil Jeong

Seog-Soon Baek

Dong-kee Sohn

Yong-Soo Lee

Sung-Hyuk Park

Chang-youl Moon

Mun-cheol Choi

Min-Soo Kim

Chang-seung Lee

Min-seog Choi

Young-jae Kim

Jeong-yub Lee

Seung-Tae Choi

Seung-Joo Shin

Seong-woon Booh

You-seop Lee

Baik-woo Lee

Eun-seok Park

Hyung-taek Lim

Sunghyuk Park

Seung-joo Shin

Dong-Seon Lee

Jang-Young Ryu

Eun-Seok Park

Woon-Bae Kim

Jin-Woo Cho

Yong-Soo Oh

Dong-Kee Sohn

A multilayer laminate package and a method of manufacturing the same are provided. The multilayer laminate package includes a cavity layer, a non-cavity layer, an electronic component, and a metalized blind via. The cavity layer includes a first adhesive layer and two first circuit layers, which are stacked with the first adhesive layer between, and an opening. The non-cavity layer includes a second adhesive layer and a second circuit layer. The non-cavity layer is bonded to the cavity layer with the second adhesive layer so as to close one side of the opening. The electronic component is mounted in the opening and is electrically connected to the non-cavity layer exposed through the opening. The metalized blind via electrically connects the non-cavity layer to one of the circuit layers of the cavity layer.

Multilayer laminate package and method of manufacturing the same

An apparatus and a method for improving communication sound quality in a mobile terminal in order to remove a neighboring noise that occurs together with a user's voice signal in a mobile terminal by discriminating signals occurring at different distances using two microphones and removing a noise. The mobile terminal preferably includes a first microphone, a second microphone, and a voice processor. The first microphone receives a voice signal occurring at a closer distance from the mobile terminal and a voice signal occurring at a longer distance from the mobile terminal. The second microphone receives only a voice signal occurring at the long distance. The voice processor discriminates between the signal occurring at the long distance and the signal occurring at the close distance by receiving voice signals received via the first microphone and the second microphone at different phases.

Apparatus and method for improving communication sound quality in mobile terminal

An ultrasonic motor includes a fixed member including a surface, a movable member positioned to face the surface of the fixed member, and an actuator to cause at least a portion of the movable member to contact the surface of the fixed member and cause the movable member to move relative to the fixed member.

Ultrasonic motor and conveying apparatus having the same

A vibrating element of an ultrasonic motor includes a vibrating member, and a piezoelectric body to produce a traveling wave thus to vibrate the vibrating member when electric power is applied to the piezoelectric body. The piezoelectric body includes a first piezoelectric layer attached to the vibrating member and in which positive poles and negative poles are alternately polarized, a second piezoelectric layer attached to the first piezoelectric layer and in which positive poles and negative poles are alternately polarized, a plurality of electrodes formed on opposite surfaces of the first and second piezoelectric layers, and an electrode connecting part formed on outer circumferential surfaces of the first and second piezoelectric layers to selectively connect the plurality of electrodes to one other.

Vibrating element, fabrication method thereof, and ultrasonic motor having the same

A piezoelectric ultrasonic motor and a method of manufacturing the piezoelectric ultrasonic motor. The piezoelectric ultrasonic motor includes: a piezoelectric body that generates a traveling wave according to an applied voltage signal; a vibrator that is attached to the piezoelectric body and vibrates; and a rotator that contacts the vibrator and is rotated by friction with the vibrating vibrator, wherein the rotator includes a plate spring member having a contact portion that contacts the vibrator, a support member that is coupled to the plate spring member and supports the plate spring member, and a buffer space defined by the plate spring member and the support member.

Piezoelectric ultrasonic motor and method of manufacturing the same

A tunable capacitor using an electrowetting phenomenon includes a first electrode; a second electrode which is spaced apart from the first electrode and faces the first electrode; a fluidic channel which is disposed between the first electrode and the second electrode; a first insulating layer which is disposed between the first electrode and the fluidic channel; and a conductive fluid which is disposed in the fluidic channel and moves along the fluidic channel when a direct current (DC) potential difference occurs between the first and second electrodes. Accordingly, it is possible to fabricate the tunable capacitor with the simplified fabrication process, good reliability and durability, and no restriction on the tuning range.

Tunable capacitor using electrowetting phenomenon

A wafer level encapsulation chip and an encapsulation chip manufacturing method. The encapsulation chip includes a device substrate, a circuit module mounted on the device substrate, a bonding layer deposited on a predetermined area of the device substrate, a protection cap forming a cavity over the circuit module and bonded to the device substrate by the bonding layer and encapsulation portions formed on predetermined areas of the bonding layer and the protection cap. Thus, the present invention can minimize damages to a chip upon chip handling and prevent moisture from being introduced into the inside of the chip.

Wafer level incapsulation chip and encapsulation chip manufacturing method

A wafer level package for a surface acoustic wave device and a fabrication method thereof include a SAW device formed with a SAW element on an upper surface of a device wafer; a cap wafer joined on an upper part of the SAW element; a cavity part housing the SAW element between the cap wafer and the SAW device; a cap pad formed on an upper surface of the cap wafer; and a metal line formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.

Wafer level package for surface acoustic wave device and fabrication method thereof

An ultrasonic motor includes a vibrating element having a piezoelectric body attached thereto to produce a traveling wave when the piezoelectric body is supplied with an electric power, and a contacting element to come in friction contact with the vibrating element when the vibrating element is vibrated by the traveling wave. The vibrating element is formed of a Mg-based alloy having a Mg content of more than 85% by weight.

Ultrasonic motor having lightweight vibrating element

A wafer level package for a surface acoustic wave (SAW) device and a fabrication method thereof. The SAW device wafer level package includes a SAW device in which a SAW element is formed on a top surface of a device wafer, a cap wafer which is bonded with a top surface of the SAW device and has a viahole penetrating the cap wafer, and a conductive member to fill a part of the viahole. The viahole has a first via portion and a second via portion, the first via portion has a gradually smaller diameter from a bottom surface of the cap wafer until a certain depth, and the second via portion has a gradually greater diameter from the first via portion until a top surface of the cap wafer.

A wafer level packaging cap for covering a device wafer with a device thereon and a fabrication method thereof are provided. The method includes operations of forming a plurality of connection grooves on a wafer, forming a seed layer on the connection grooves, forming connection parts by filling the connection grooves with a metal material, forming cap pads on a top surface of the wafer to be electrically connected to the connection parts, bonding a supporting film with the top surface of the wafer on which the cap pads are formed, forming a cavity on a bottom surface of the wafer to expose the connection parts through the cavity, and forming metal lines on the bottom surface of the wafer to be electrically connected to the connection parts.

Wafer level packaging cap and fabrication method thereof

A micro package, a multi-stack micro package, and a manufacture method therefor are provided. A micro package according to the present invention includes a device substrate for mounting a devices, being a circuit module; a protection cap for protecting the device; bonding substances which, formed by patterning on predetermined areas on the device substrate, bond the device substrate and the protection cap; layers formed on a portion of the device substrate and a portion of the protection cap and exterior sides of the bonding substances; vias which are formed by etching away another portion of the protection cap, and electrically connected to an upper surface of the device substrate through the bonding substances; under barrier metals (UBMs) formed on the vias; and solder bumpers, being connection terminals for an external signal, formed on the UBMs. As stated above, the present invention has advantages of guaranteeing the hermetical sealing since the above layers prevent moisture absorption from outside at the same time of lowering possibility of damages to the device inside the package since the processing temperature drops below 150&#xb0; upon wafer bonding due to the use of the polymer substance as a bonding substance.

Micro-package, multi-stack micro-package, and manufacturing method therefor

An apparatus and method for driving an ink-jet printhead in which current is applied to a heater to heat ink to be supplied in an ink chamber to generate a bubble to eject ink from the ink chamber, the apparatus including a circuit that alternately applies current to the heater to alternate a direction of current flowing through the heater.

Apparatus and method for driving an ink-jet printhead

A thermally-driven ink-jet printhead includes a substrate having an ink chamber to be filled with ink to be ejected, a manifold for supplying ink, and an ink channel for providing flow communication therebetween. First and second sidewalls are formed to a predetermined depth from an upper surface of the substrate and define the ink chamber to have a substantially rectangular shape. A nozzle plate including a plurality of material layers is formed on the substrate. A nozzle passes through the nozzle plate and is in flow communication with the ink chamber. A heater is disposed between the nozzle and one of the first sidewalls above the ink chamber. A conductor is electrically connected to the heater. The conductor and the heater are disposed within the nozzle plate. A shifting feature moves cavitation points beyond an outer edge of the heater.

Growing community of inventors

Suwon-si, South Korea

Ji-Hyuk Lim