The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
Jun. 07, 2006
Byung-gil Jeong, Anyang-si, KR;
In-sang Song, Seoul, KR;
Woon-bae Kim, Suwon-si, KR;
Min-seog Choi, Seoul, KR;
Suk-jin Ham, Seoul, KR;
Ji-hyuk Lim, Suwon-si, KR;
Byung-gil Jeong, Anyang-si, KR;
In-sang Song, Seoul, KR;
Woon-bae Kim, Suwon-si, KR;
Min-seog Choi, Seoul, KR;
Suk-jin Ham, Seoul, KR;
Ji-hyuk Lim, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A wafer level encapsulation chip and an encapsulation chip manufacturing method. The encapsulation chip includes a device substrate, a circuit module mounted on the device substrate, a bonding layer deposited on a predetermined area of the device substrate, a protection cap forming a cavity over the circuit module and bonded to the device substrate by the bonding layer and encapsulation portions formed on predetermined areas of the bonding layer and the protection cap. Thus, the present invention can minimize damages to a chip upon chip handling and prevent moisture from being introduced into the inside of the chip.