Suk-jin Ham

Title: Suk-jin Ham: Innovator in Wafer Level Packaging Technology

Introduction

Suk-jin Ham is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly in wafer level encapsulation technologies. With a total of 6 patents to his name, Ham's work has been instrumental in advancing the efficiency and reliability of electronic devices.

Latest Patents

One of his latest patents is the "Wafer Level Encapsulation Chip and Encapsulation Chip Manufacturing Method." This invention features a wafer level encapsulation chip that includes a device substrate, a circuit module mounted on the substrate, and a protection cap that forms a cavity over the circuit module. The design minimizes damage to the chip during handling and prevents moisture from entering the chip, enhancing its durability.

Another notable patent is the "Wafer Level Package for Surface Acoustic Wave Device and Fabrication Method Thereof." This invention involves a surface acoustic wave (SAW) device with a SAW element on the upper surface of a device wafer. The design includes a cap wafer that houses the SAW element, ensuring that both the device wafer and cap wafer are made from the same materials, which simplifies the manufacturing process and improves performance.

Career Highlights

Suk-jin Ham is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in the field of semiconductor technology. His work has not only contributed to the company's success but has also set new standards in the industry.

Collaborations

Throughout his career, Ham has collaborated with talented individuals such as Woon-bae Kim and Ji-Hyuk Lim. These collaborations have fostered a creative environment that has led to groundbreaking advancements in their respective fields.

Conclusion

Suk-jin Ham's contributions to wafer level packaging technology have made a significant impact on the electronics industry. His innovative patents demonstrate his commitment to enhancing the performance and reliability of electronic devices.