Location History:
- Portland, OR (US) (2020 - 2021)
- Hillsboro, OR (US) (2019 - 2022)
Company Filing History:
Years Active: 2019-2025
Title: Innovations of Jun Liao
Introduction
Jun Liao is a prominent inventor based in Hillsboro, Oregon, known for his significant contributions to the field of semiconductor technology. With a total of 11 patents to his name, Liao has made remarkable advancements that enhance the performance and reliability of memory devices.
Latest Patents
One of Liao's latest patents is for a memory device package with noise shielding. This innovative memory device includes a grounded molding and a substrate that features a first surface for a memory die. The substrate is designed with ground vias that connect to a ground reference, and it has a ball grid array (BGA) on the opposite surface, which includes perimeter balls for ground connections. The grounded molding, made from an electrically conductive epoxy, covers the memory die and provides radio frequency interference (RFI) shielding when grounded. Another notable patent is for a stiffener and package substrate for a semiconductor package. This patent describes techniques for fabricating a package substrate that includes a routing layer with a dielectric layer. A stiffener is positioned above the routing layer, and a conductive line extends from one region of the routing layer to another, with specific widths and orientations that enhance the functionality of the semiconductor package.
Career Highlights
Throughout his career, Jun Liao has worked with leading technology companies, including Intel Corporation and Apple Inc. His experience in these organizations has allowed him to develop cutting-edge technologies that have a lasting impact on the industry.
Collaborations
Liao has collaborated with notable colleagues such as Xiang Li and James A McCall, contributing to various projects that push the boundaries of semiconductor innovation.
Conclusion
Jun Liao's work exemplifies the spirit of innovation in the semiconductor field. His patents reflect a deep understanding of technology and a commitment to advancing the capabilities of memory devices. His contributions continue to influence the industry and inspire future innovations.