The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Jun. 25, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Zhen Zhou, Chandler, AZ (US);
Jun Liao, Hillsboro, OR (US);
Xiang Li, Portland, OR (US);
Kevin Stone, Hillsboro, OR (US);
Daqiao Du, Beaverton, OR (US);
Tae-Young Yang, Portland, OR (US);
Ling Zheng, Chandler, AZ (US);
James A. McCall, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01R 12/71 (2011.01); H01R 43/20 (2006.01); H01R 43/16 (2006.01); H01R 12/57 (2011.01); H01R 12/52 (2011.01); H01R 13/6467 (2011.01); H01R 12/70 (2011.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/49827 (2013.01); H01R 12/52 (2013.01); H01R 12/57 (2013.01); H01R 12/714 (2013.01); H01R 13/6467 (2013.01); H01R 43/16 (2013.01); H01R 43/20 (2013.01); H01R 12/707 (2013.01);
Abstract
An apparatus is described. The apparatus includes an electro-mechanical interface having angled signal interconnects, wherein, the angling of the signal interconnects is to reduce noise coupling between the angled signal interconnects.