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James A McCall

This inventor holds 88 USPTO granted patents and 28 published patent applications and 13 EPO patents, primarily in High Bandwidth Memory (CPC class G11C11-4093). Top assignees: Intel Corporation, Tahoe Research, Ltd.. Active years: 2002-2026.

USPTO Granted Patents = 88 (Patent Applications = 28)

% Patents Active = 73.9

EPO Patents = 13 (Patent Applications = 17)

Average Co-Inventor Count = 2.9

ph-index = 11

Forward Citations = 460(Granted Patents)

Forward Citations (Not Self Cited) = 405(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hillsboro, OR (US) (2009)
Beaverton, OR (US) (2002 - 2015)
Portland, OH (US) (2018)
Portland, OR (US) (2012 - 2024)

Company Filing History:

Years Active: 2002-2026

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Areas of Expertise:

High Bandwidth Memory

Dynamic Bus Inversion

Error Correction

Memory Device

Signal Noise

Interconnect Structure

Impedance Compensation

Clock Performance

DDR Memory Bus

Chip Select

Cross-Talk Noise

Memory Channel Driver

88 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12706407 - Shielded socket pin for device-to-device connection (2026-08-11),

2. 12660078 - Trace design to reduce the connector crosstalk (2026-06-16),

3. 12619562 - Unidirectional command bus phase drift compensation by sending the command bus delay to memory controller (2026-05-05),

4. 12573795 - Pin configuration for device-to-device connection (2026-03-10),

5. 12373287 - Distribution of error checking and correction (ECC) bits to allocate ECC bits for metadata (2025-07-29),

6. 12340863 - Stacked memory chip solution with reduced package inputs/outputs (I/Os) (2025-06-24),

7. 12332739 - Buffer that supports burst transfers having parallel CRC and data transmissions (2025-06-17),

8. 12217787 - Apparatus, system and method to detect and improve an input clock performance of a memory device (2025-02-04),

9. 12087352 - Techniques to couple high bandwidth memory device on silicon substrate and package substrate (2024-09-10),

10. 12073906 - Package pin pattern for device-to-device connection (2024-08-27),

11. 11776619 - Techniques to couple high bandwidth memory device on silicon substrate and package substrate (2023-10-03),

12. 11657862 - Electrically coupled trace routing configuration in multiple layers (2023-05-23),

13. 11569161 - Integrated memory coplanar transmission line package having ground path that brackets data path to extend memory speeds (2023-01-31),

14. 11557333 - Techniques to couple high bandwidth memory device on silicon substrate and package substrate (2023-01-17),

15. 11335395 - Applying chip select for memory device identification and power management control (2022-05-17),

Title: James A McCall: Pioneering Innovations with High Bandwidth Memory Devices

Introduction:

In the realm of technological advancements, James A McCall has established himself as an esteemed inventor and collaborator. Hailing from Portland, Oregon (USA), McCall has amassed an impressive portfolio of 78 patents, showcasing his expertise in coupling high bandwidth memory devices and optimizing electrical trace routing configurations. This article explores the latest patents of James A McCall, highlights his career achievements, and delves into notable collaborations that have shaped his innovative journey.

Latest Patents:

McCall's recent patents demonstrate his ingenuity in the field of high bandwidth memory devices. His techniques for coupling such devices on silicon substrates and package substrates illustrate his focus on improving efficiency and performance. By selectively activating input/output (I/O) or command and address (CA) contacts, McCall enhances the means of accessing memory devices within high bandwidth memory devices through data channels. Additionally, his electrically coupled trace routing configuration in multiple layers enables increased clock speeds by minimizing impedance, benefiting components like DRAM on substrates.

Career Highlights:

Throughout his career, McCall has worked with renowned companies, further cementing his position as a prominent innovator. Notably, he has contributed his expertise to Intel Corporation and Tahoe Research, Ltd. His association with these influential organizations has allowed him to push the boundaries of technological advancements and leave a lasting impact on the industry.

Collaborations:

Collaboration has been a prominent aspect of McCall's journey, facilitating the exchange of ideas and pushing the boundaries of innovation even further. Alongside his career, McCall has actively collaborated with esteemed professionals, including Kuljit Singh Bains and Michael W Leddige. These collaborations have resulted in groundbreaking advancements, fostering a dynamic environment for knowledge sharing and technological progress.

Conclusion:

James A McCall's expertise in the realms of high bandwidth memory devices, electrically coupled trace routing, and collaborative innovation has positioned him as a trailblazer in the industry. With 78 patents to his name, McCall has proven his ability to conceptualize and execute pioneering ideas. Through his work with notable companies, such as Intel Corporation and Tahoe Research, Ltd., and his collaborations with esteemed colleagues, McCall continues to drive advancements in the field of technology. His contributions highlight the importance of innovation, collaboration, and the pursuit of knowledge in shaping a brighter future.

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