The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Oct. 19, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Xiang Li, Portland, OR (US);

Saravanan Sethuraman, Portland, OR (US);

George Vergis, Portland, OR (US);

James A. Mccall, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H10W 90/00 (2026.01); H01R 12/73 (2011.01);
U.S. Cl.
CPC ...
H05K 1/117 (2013.01); H05K 1/18 (2013.01); H10W 90/00 (2026.01); H01R 12/737 (2013.01); H05K 2201/09172 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10545 (2013.01);
Abstract

According to examples, a memory module with module rows of conductive contacts can enable multiple memory channels to be connected to the same memory module. In one example, a memory module includes a printed circuit board (PCB) having a first face, a second face, and an edge to be received by a connector. The memory module includes a plurality of memory chips on at least one of the first and second faces of the PCB. The memory module includes two or more rows of conductive contacts on each of the first and second faces of the PCB, the two rows including a first row of conductive contacts proximate to the edge of the PCB to be received by the connector, and a second row of conductive contacts between the first row and a second edge of the PCB opposite to the first edge.


Find Patent Forward Citations

Li, Xiang. (2026). Multi-channel memory module (U.S. Patent No. 12764861). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12764861

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…