The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Aug. 26, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Landon Hanks, Milwaukie, OR (US);

Xiang Li, Portland, OR (US);

George Vergis, Portland, OR (US);

James A. Mccall, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01R 12/72 (2011.01); H01R 12/73 (2011.01); H05K 1/11 (2006.01); H05K 1/181 (2026.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H01R 12/721 (2013.01); H01R 12/737 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/10 (2013.01); H05K 2201/09272 (2013.01); H05K 2201/10159 (2013.01);
Abstract

Examples described herein relate to a system that includes: a circuit board comprising a plurality of layers, first and second conductive connections, first and second trace portions, first, second, and third routings, and a via wherein: the first conductive connection is coupled to the first trace portion, the second conductive connection is coupled to the second trace portion, the first routing is formed in a first layer of the plurality of layers, the second routing is formed in a second layer of the plurality of layers, the third routing is formed in the first layer of the plurality of layers, a portion of the first routing overlaps with a portion of the second routing to provide a capacitive region, and the via conductively couples a portion of the second routing overlaps with a portion of the third routing.


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