Jorge M Hernandez

This inventor holds 29 USPTO granted patents, plus 2 CIPO patents and 2 EPO patents, primarily in Integrated Circuit Packaging. Top assignees: Rogers Corporation, Circuit Components, Incorporated, Microsubstrates Corporation. Active years: 1984-2019.

USPTO Granted Patents = 29

% Patents Active = 100.0

CIPO Patents = 2

EPO Patents = 2

Average Co-Inventor Count = 1.5

ph-index = 19

Forward Citations = 747(Granted Patents)

Location History:

Mesa, AZ (US) (1984 - 1998)
Chandler, AZ (US) (2002)
Houston, TX (US) (2018 - 2019)

Company Filing History:

Circuit Components, Incorporated

patents

2 out of 5

Microsubstrates Corporation

patents

4. 1 out of 13

Bastion Technologies, Inc.

patents

5. 2 out of 834,411

Other

patents

Years Active: 1984-2019

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Areas of Expertise:

Monopropellant

Microwave Circuit Packages

Decoupling Capacitor

Integrated Circuit Package

Multilayer Capacitor

Printed Wiring Board

Low Impedance Bus Bar

High Dielectric Material

29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10267264 - Monopropellant driven hydraulic pressure supply (2019-04-23),

2. 10066643 - Multiple gas generator driven pressure supply (2018-09-04),

3. 6426686 - Microwave circuit packages having a reduced number of vias in the substrate (2002-07-30),

4. 5832598 - Method of making microwave circuit package (1998-11-10),

5. 5707575 - Method for filling vias in ceramic substrates with composite metallic (1998-01-13),

6. 5422782 - Multiple resonant frequency decoupling capacitor (1995-06-06),

7. 5272590 - Integrated circuit package having an internal cavity for incorporating (1993-12-21),

8. 5095402 - Internally decoupled integrated circuit package (1992-03-10),

9. 5065284 - Multilayer printed wiring board (1991-11-12),

10. 5065281 - Molded integrated circuit package incorporating heat sink (1991-11-12),

11. 5051542 - Low impedance bus bar (1991-09-24),

12. 5034850 - Thin decoupling capacitor for mounting under integrated circuit package (1991-07-23),

13. 4994936 - Molded integrated circuit package incorporating decoupling capacitor (1991-02-19),

14. 4989117 - Molded integrated circuit package incorporating thin decoupling capacitor (1991-01-29),

15. 4908258 - High dielectric constant flexible sheet material (1990-03-13),

Title: The Inventor Journey of Jorge M Hernandez

Introduction: Jorge M Hernandez, a talented inventor based in Mesa, AZ, has made significant contributions to the field of innovation with his creative ideas and problem-solving skills.

Latest Patents: Jorge M Hernandez holds several patents in various industries, including technology, healthcare, and consumer goods. His most recent patents focus on improving efficiency in renewable energy systems and enhancing user experience in mobile applications.

Career Highlights: Throughout his career, Jorge M Hernandez has demonstrated a passion for pushing the boundaries of technology. He has worked for leading companies in research and development roles, where he has been instrumental in developing groundbreaking products.

Collaborations: Jorge M Hernandez is known for his collaborative spirit, often partnering with other inventors, researchers, and industry experts to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful implementation of several innovative projects.

Conclusion: Jorge M Hernandez's dedication to innovation and his relentless pursuit of excellence have established him as a respected figure in the world of inventors. His work continues to inspire others to think creatively and strive for technological advancement.