The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 1991
Filed:
Feb. 12, 1990
Jorge M Hernandez, Mesa, AZ (US);
Rogers Corporation, Rogers, CT (US);
Abstract
A decoupling scheme which is particularly well suited for use with molded integrated circuit packages incorporating lead frames is presented. In accordance with the present invention, a thin decoupling capacitor is used which is comprised of a ceramic or like substrate having printed or otherwise applied thereon conductive layers, dielectric layers (e.g., glass/ceramic dielectric paste or dielectric sol-gel) and protective layers. Mounted on this thin capacitor is an integrated circuit chip. This thin capacitor/IC chip assembly is attached directly to the IC lead frame and thereafter encapsulated within the molded package resulting in a decoupling scheme which is internal to the molded IC package. Printed conductors on the thin capacitor's ceramic substrate are attached to appropriate fingers of the lead frame by welding, soldering or the like to effect strong mechanical and electrical contact.