The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 1998
Filed:
Jul. 28, 1994
Applicant:
Inventors:
David K Litt, Mesa, AZ (US);
Jorge M Hernandez, Mesa, AZ (US);
Assignee:
Micro Substrates Corporation, Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B / ;
U.S. Cl.
CPC ...
264104 ; 264259 ;
Abstract
A method and apparati for improved filling of via holes wherein compressive force is used to columnate conductive material due to a pseudoplastic thixotropic rheology of the material. Columnating of the material provides for easier and more accurate filling of via holes. Both automated roller apparati and manual methods are provided. The method further includes methods and apparati of removing excess conductive material from substrates after filling the via holes.