CIPO Patents = 1

Forward Citations = 188

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6 inventors (with patents filed for the assignee):

Daniel F Douriet (2 out of 2 patents)

Ramachandra M Panicker (2 out of 5 patents)

Jorge M Hernandez (2 out of 29 patents)

4. Anil K Agarwal (1 out of 3 patents)

5. M P Ramachandra Panicker (1 out of 1 patent)

6. David K Litt (1 out of 1 patent)

7. Ramachandra M P Panicker (0 patent)

8. Anil K Agarwal (0 patent)

5 patents: Sort by Forward Citations

1. 6426686 - Microwave circuit packages having a reduced number of vias in the substrate (2002-07-30),

2. 6215377 - Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format (2001-04-10),

3. 5707575 - Method for filling vias in ceramic substrates with composite metallic (1998-01-13),

4. 5089881 - Fine-pitch chip carrier (1992-02-18),

5. 4942076 - Ceramic substrate with metal filled via holes for hybrid microcircuits (1990-07-17),

Company Overview

Microsubstrates Corporation is a leading provider of advanced technology solutions for the semiconductor industry. With a strong focus on innovation and quality, we deliver cutting-edge microsubstrates that enable our clients to achieve higher levels of performance and reliability in their electronic devices. Our team of experts is dedicated to providing exceptional products and services to meet the unique needs of our customers.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

5 Patents

#97 in Tempe, AZ

#694 in Arizona

#51,644 in US

Tempe, AZ, United States of America

Microsubstrates Corporation

Forward Citations = 188

6 inventors:

Daniel F Douriet (2 out of 2 patents)

Ramachandra M Panicker (2 out of 5 patents)

Jorge M Hernandez (2 out of 29 patents)

4. Anil K Agarwal (1 out of 3 patents)

5. M P Ramachandra Panicker (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Microsubstrates Corporation. Retrieved from https://idiyas.com/company/microsubstrates

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent (CIPO):

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]