CIPO Patents = 1

Forward Citations = 187

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6 inventors (with patents filed for the assignee):

Daniel F Douriet (2 out of 2 patents)

Ramachandra M Panicker (2 out of 5 patents)

Jorge M Hernandez (2 out of 29 patents)

4. Anil K Agarwal (1 out of 3 patents)

5. M P Ramachandra Panicker (1 out of 1 patent)

6. David K Litt (1 out of 1 patent)

7. Ramachandra M P Panicker (0 patent)

8. Anil K Agarwal (0 patent)

5 patents: Sort by Forward Citations

1. 6426686 - Microwave circuit packages having a reduced number of vias in the substrate (2002-07-30),

2. 6215377 - Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format (2001-04-10),

3. 5707575 - Method for filling vias in ceramic substrates with composite metallic (1998-01-13),

4. 5089881 - Fine-pitch chip carrier (1992-02-18),

5. 4942076 - Ceramic substrate with metal filled via holes for hybrid microcircuits (1990-07-17),

Microsubstrates Corporation is a leading provider of advanced technology solutions for the semiconductor industry. With a strong focus on innovation and quality, we deliver cutting-edge microsubstrates that enable our clients to achieve higher levels of performance and reliability in their electronic devices. Our team of experts is dedicated to providing exceptional products and services to meet the unique needs of our customers.

This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Jan 6 2026

5 Patents

#97 in Tempe, AZ

#689 in Arizona

#50,255 in US

Tempe, AZ, United States of America

Microsubstrates Corporation