Daniel F Douriet

Title: The Innovations of Daniel F Douriet

Introduction

Daniel F Douriet is a notable inventor based in Rochester, MN (US). He has made significant contributions to the field of microwave circuit technology. With a total of two patents to his name, Douriet's work focuses on enhancing signal transmission and reducing impedance mismatches in microwave circuit packages.

Latest Patents

Douriet's latest patents include "Microwave circuit packages having a reduced number of vias in the substrate" and "Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format." The first patent describes a circuit package for microwave signals that features a substrate devoid of signal carrying vias. This innovative design includes a waveguide and a MMIC that are in electrical communication, providing an efficient transmission path for signals. The second patent outlines a MMIC package that employs a trace pattern of a coplanar waveguide, which matches impedances at all transitions to enhance signal transmission and avoid reflection. This design utilizes metalization on a dielectric substrate to improve signal propagation and reduce impedance mismatches.

Career Highlights

Douriet is currently employed at Microsubstrates Corporation, where he continues to develop cutting-edge technologies in microwave circuits. His work has been instrumental in advancing the capabilities of microwave signal transmission.

Collaborations

Throughout his career, Douriet has collaborated with talented individuals such as Jorge M Hernandez and M P Ramachandra Panicker. These collaborations have contributed to the innovative solutions he has developed in the field.

Conclusion

Daniel F Douriet's contributions to microwave circuit technology through his patents and work at Microsubstrates Corporation highlight his role as a significant inventor in the industry. His innovative designs continue to influence the field of microwave engineering.