Title: The Innovations of Ramachandra M P Panicker
Introduction
Ramachandra M P Panicker is an accomplished inventor known for his contributions to the field of hybrid microcircuits. His innovative work primarily focuses on the development of ceramic substrates that enhance the performance of microelectronic devices. Despite having no patents registered under his name, his notable invention has made a significant impact in the industry.
Latest Patents
One of his key inventions is the "Ceramic Substrate With Metal Filled Via Holes For Hybrid Microcircuits And Method Of Making The Same." This invention involves an alumina substrate designed for hybrid microcircuits that utilize GaAs dies operating at gigahertz frequencies. The substrate features numerous via holes, approximately 0.013 inches in diameter, which are drilled using laser technology. Each via hole is filled with a metal composition consisting of about 85% sintered tungsten and 15% copper, ensuring a thermal coefficient of expansion that aligns with both the GaAs dies and the alumina substrate. This design not only facilitates effective heat dissipation but also provides low inductance ground paths for the microcircuit.
Career Highlights
Throughout his career, Ramachandra M P Panicker has worked with various companies, including Anil K. Agarwal. His expertise in the field of microelectronics has allowed him to contribute to advancements in hybrid microcircuits, showcasing his innovative spirit and technical knowledge.
Collaborations
His collaboration with Anil K Agarwal has been noteworthy, as they have worked together on projects that push the boundaries of microelectronic technology.
Conclusion
Ramachandra M P Panicker's work in the field of hybrid microcircuits exemplifies the importance of innovation in technology. His contributions, particularly in the development of ceramic substrates, have paved the way for advancements in microelectronics.
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